New SMT Equipment: via plugged void (Page 1 of 3)

IPC 6012C Qualification and Performance Specification for Rigid Printed Boards

IPC 6012C Qualification and Performance Specification for Rigid Printed Boards

New Equipment | Education/Training

This specification covers qualification and performance of rigid PCBs including with or without plated-through holes, single-sided, double-sided, multilayer with or without blind/buried vias and metal core boards. It addresses final finish and surfac

BEST Inc.

IPC-A-600H Standard

IPC-A-600H Standard

New Equipment | Education/Training

IPC A-600H Acceptability of Electronic Assemblies. The IPC-A-600, "Acceptability of Printed Boards " is the most widely used published specification on printed wiring boards. This specification has set the standard for rigid printed boards in terms o

BEST Inc.

8 layers PCB with blind buried vias

8 layers PCB with blind buried vias

New Equipment | Fabrication Services

Minimum line width/space: 4mils Surface finish: immersion gold Board thickness: 1.60MM Minimum drilled hole diameter: 4mils Copper thickness: 0.5oz Special process : 0.25MM BGA , resin plugged vias in BGA pads

CYZON LIMITED

XT-3 High-Resolution X-Ray Analyser

XT-3 High-Resolution X-Ray Analyser

New Equipment | Inspection

40mm Applications Solder Joint Quality (BGA, Leaded) Bridging Voiding Opens Bare boards (Inner layers, traces, vias) Component Package Inspection (wire bonds) Subtle Defect Inspection

MatriX Technologies GmbH

IPC 6012D Qualification and Performance Specification for Rigid Printed Boards

IPC 6012D Qualification and Performance Specification for Rigid Printed Boards

New Equipment | Other

IPC 6012 Qualification and Performance Specification for Rigid Printed Boards This specification covers qualification and performance of rigid PCBs including with or without plated-through holes, single-sided, double-sided, multilayer with or withou

soldertools.net

Indium Solder Pastes

Indium Solder Pastes

New Equipment | Solder Materials

Indium Corporation manufactures high quality solder powders and pastes. Powders are available in hundreds of alloys and a full range of sizes. Solder pastes can be made from these powders using a wide variety of flux vehicles to get the best fit for

Indium Corporation

USB to Serial

USB to Serial

New Equipment | Other

These adapters enable you to add serial ports to your PC Workstation or Embedded System, providing the ability to communicate between USB (Universal Serial Bus) and serial peripherals. The driver adds Windows serial COM-ports via USB connection, the

VSCOM - Vision Systems GmbH

IPC-A-600H Standard

IPC-A-600H Standard

New Equipment | Education/Training

IPC A-600H Acceptability of Electronic Assemblies. The IPC-A-600, "Acceptability of Printed Boards " is the most widely used published specification on printed wiring boards. This specification has set the standard for rigid printed boards in terms o

soldertools.net

FLIR A320 Thermal Imaging

FLIR A320 Thermal Imaging

New Equipment | Test Equipment

FLIR A320 Thermal Imaging $11,950.00 Resolution, Plug & Play Infrared Camera for Machine Vision The FLIR A320 Infrared Camera is an affordable and accurate solution for machine vision and automation systems that require non-contact imaging and te

Test Equipment Connection

JT 2149/DAF Mixed Signal Tester Module

JT 2149/DAF Mixed Signal Tester Module

New Equipment | Test Equipment

Measures DIO, Analog Voltage and Frequency in One Module. The JT 2149/DAF is a compact, mixed-signal (Digital/Analog/Frequency) measurement module and is the first unit of its type to offer both digital and analogue test access to PCBs via JTAG Tech

JTAG Technologies B. V.


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