New SMT Equipment: wire clamp bonder (Page 1 of 7)

Semi-Automatic SMT Production Lines

Semi-Automatic SMT Production Lines

New Equipment | Assembly Services

PCB Assembly Equipment, PCB Machine, SMD/SMT Assembly, SMT assembly line, SMT plaeement line, automatic production line Semi-automatic SMT production lines ETA Electronic equipment Co., Ltd. To provide professional SMT automatic production line sol

I.C.T ( Dongguan ICT Technology Co., Ltd. )

Bondjet BJ931 - High Speed Fully Automatic Dual-Head Wedge Bonder

Bondjet BJ931 - High Speed Fully Automatic Dual-Head Wedge Bonder

New Equipment | IC Packaging

The Bondjet BJ931 High Speed Fully Automatic Dual-Head Wedge Bonder meets the latest technology and flexibility demands for automotive and power electronics applications, handling thin and heavy aluminum, copper and gold wire and ribbon on two specia

Hesse Mechatronics

Ultrasonic Engineering   Al Wedge Wire Bonder

Ultrasonic Engineering Al Wedge Wire Bonder

New Equipment |  

Spec. : Al wedge wire bonder, Fine wire 25 to 50 micron meter diameter, Rotation head, 60kHz Ultrasonic, Bonding area 104x104 mm Remarks : Manual

Tanaka Corporation

Manual Wire Bonder

Manual Wire Bonder

New Equipment | Other

For Wire Bonding (Wedge and Ball Bonding)

K-Net International Ltd.,Part

Wire Clamp / Cutter

Wire Clamp / Cutter

New Equipment | Components

For Wire Bonding (Heavy Wire Wedge Bonding)

K-Net International Ltd.,Part

Leapfrog 3D Printer

New Equipment | Printing

3D Printers  Rapid Prototyping Equipment  Semiconductor Equipment - Rework Stations - Wire Bonders -  Palomars, Orthodyne, Delvotec

CSI Equipmet Sales

Semiconductor Tools

New Equipment |  

Front End: Previously owned (new & used) equipment used for fabrication of semiconductor wafers and similar devices. Includes coater/developers, CVD, PECVD, etch tools, steppers, sputtering tools, ashers, evaporators. Back End: Previously owned (

ECD Tools Inc.

HYBRID/MCM DESIGNER

HYBRID/MCM DESIGNER

New Equipment |  

This module adds creation of thick-film, thin-film, laminate and ceramic MCMs. Dies are easily captured from any type of data (faxed, standard data files or GDSII). Bonding pads made with any number of rows, straight or curved, fanouts using equal

CAD Design Software

UniStrip 2300 - Stripping Machine

UniStrip 2300 - Stripping Machine

New Equipment | Cable & Wire Harness Equipment

Overview The UniStrip 2300 programmable stripping machine strips wires ranging in size from 0.03 – 6 mm² (32 – 10 AWG) and jacketed cables up to 5.5 mm (0.22“) in diameter. This innovative machine does not require any mechanical adjustments to proce

Schleuniger, Inc.

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