Electronics Forum | Wed Feb 01 02:21:26 EST 2017 | rob
80 micrometres (0.08mm) or 80 mil (2mm)? Smallest I've seen reliably printed is around 0.2mm x 0.4mm (01005 pad) and 0.2mm x 0.2mm CSP pad, not seen anything dispensed below 0.35ish, but we are not cutting edge.
Electronics Forum | Mon Feb 04 12:28:28 EST 2008 | jseagle
1.0mm (0.039") 1.75X >0.5 to 1.0mm (0.02 to 0.039") 4X 0.25 to 0.5mm (0.00984 to 0.02") 10X
Electronics Forum | Mon Jul 25 17:24:25 EDT 2005 | Kris
0.2% lead will make your solder non compliant with RoHS when you move to a completely RoHS compliant BOM. Check with your bar vendor how much it will take to convert a pot containing 0.2% lead to
Electronics Forum | Fri Oct 03 01:01:09 EDT 2008 | khushi
Dear All, I would like to know that what are the problems which will be encountered while mounting 01005 components & BGA's on the PCB for thickness 0.2mm and what will be the processes involved in mounting the components.
Electronics Forum | Thu Jan 30 10:12:00 EST 2020 | emeto
More detail Jinesh. Profile, datasheet of the part, stencil design, PCB finish, soldering material. Initially I am assuming you use pallet to reflow 0.2mm thick board.
Electronics Forum | Thu Nov 14 10:52:56 EST 2019 | jandon
Maybe something like this could work?
Electronics Forum | Tue Dec 31 02:13:14 EST 2019 | agoesfirmanto
This PCB model has been in production since 2018 and stopped production almost 1 year ago, now it has started production again and I found this problem. at the time of production in 2018 this problem did not occur. while the parameter settings do not
Electronics Forum | Tue Nov 12 00:49:37 EST 2019 | myke03o
I am optimizing a stencil opening for BGA with 0.4mm pitch and pad diameter of 0.2mm. Can anyone advice of stencil thickness and stencil opening I can use in order to have a good paste release. Thanks for all your answers.
Electronics Forum | Mon Nov 09 15:52:42 EST 2009 | sawyer
Hi, as i know the reject rate it should be under 0,2%.
Electronics Forum | Thu Aug 29 20:34:02 EDT 2002 | ppwlee
A gap of 150-200� between potential shadow components is enough to eliminate those problems. Dave, Can you clarify? Do you mean 0.015 to 0.02?? Peter
