Electronics Forum | Thu Feb 24 11:02:29 EST 2000 | mark scheunemann
I am looking to discuss 0402 issues, specifically tombstoning/unsoldered. Any recommendations on pad size/spacing, stencil design etc would be helpful. Placement and reflow profile look good.
Electronics Forum | Thu Feb 24 11:02:29 EST 2000 | mark scheunemann
I am looking to discuss 0402 issues, specifically tombstoning/unsoldered. Any recommendations on pad size/spacing, stencil design etc would be helpful. Placement and reflow profile look good.
Electronics Forum | Thu Apr 11 20:35:22 EDT 2002 | davef
Messy. Messy. Messy. Consider gluing these components, until you control your process. It is unclear to us that a single factor drives these defects, but multiple factors that need to be tuned to work well together. PAD DIMENSIONS * Some SM-782 pa
Electronics Forum | Fri Jul 24 09:50:13 EDT 1998 | Justin Medernach
200 boards/Hr and oven will reflow ~180 boards/Hr but the P&P machine will only place 700-950 CPH | when setup is taken into account. Minimum pitch is normally .020" and we place an Avg. of 491 TSSOPs and 217 BGAs a month. | We don't even bother wit
Electronics Forum | Fri Jul 24 16:02:13 EDT 1998 | Justin Medernach
200 boards/Hr and oven will reflow ~180 boards/Hr but the P&P machine will only place 700-950 CPH | | | when setup is taken into account. Minimum pitch is normally .020" and we place an Avg. of 491 TSSOPs and 217 BGAs a month. | | | We don't even bo
Electronics Forum | Fri Jul 24 12:12:52 EDT 1998 | smd
200 boards/Hr and oven will reflow ~180 boards/Hr but the P&P machine will only place 700-950 CPH | | when setup is taken into account. Minimum pitch is normally .020" and we place an Avg. of 491 TSSOPs and 217 BGAs a month. | | We don't even bother
Electronics Forum | Thu Nov 30 19:19:40 EST 2023 | daniel_stanphill
ProcEng1 made a super important point. The packaging needs to be able to survive the temps needed to reflow the paste. There are a number of jobs we have that we either hand or selective solder the connectors after the surface mount is done for that
Electronics Forum | Thu Mar 08 12:40:54 EST 2001 | Ralph Merk
We are currently using 0402 resistors and capacitors in our production process. Our equipment is as follows: - DEK 265 - Siemens S25/F5 - Vitronics XPM520(5 zones) - 2% silver solder Alpha WS678 The problem is that randomly some 0402 capacitors are
Electronics Forum | Thu Apr 12 00:43:38 EDT 2001 | zam_bri
Can anybody gimme some input on the problem I faced currently on 0402 Chip Resistor. At pre-reflow the component are placed nicely but at post reflow, we found the Resistor stands sideway ( both termination, the pad and componant are in contact, fun
Electronics Forum | Thu Oct 28 08:28:33 EDT 2010 | d0min0
Hi, previous topics found closed so I couldn't continue on them, but wanted to ask maybe something that we don't already know paste shape and placement ok, reflow 12 zones profile looks ok (same since 2 yrs), component placement ok, one reference i
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