Electronics Forum | Mon May 29 02:24:32 EDT 2000 | Dreamsniper
Hi Guys, Has anyone of you ever tried a GSM1 Multi Pitch Feeders with a GSM1 UPS Version 1.3.5 ? I've Inquired with Universal guys and they said that they have not tried this feeders with this old software rev but they said that there shouldn't be a
Electronics Forum | Wed Jan 31 17:45:37 EST 2001 | dason_c
Hi! William, please check the new IPC-A-610 Rev C, para 12.4.10 for the soldeirng anomalies. Most of them may consider as process indicator and not the defect. The most common method to elimate the solder ball is to reduce the solder volume by red
Electronics Forum | Thu Oct 26 18:10:11 EDT 2000 | ptvianc
Philip: Cases 1-3, those criteria may be specified in more recent versions of ANSI/J-STD-001 and/or ANSI/IPC-A-610. Unfortunately, I do not have any new versions of these specs. that may cover these points. As for voids in BGA joints, I have not
Electronics Forum | Tue May 15 09:01:41 EDT 2001 | davef
Stephan makes good points. While monitoring the temperature in the plant is good, it might be more appropriate to measure the temperature in the cabinet of your dispensor. A sure indicator of temperature change is process changes over time. Consid
Electronics Forum | Mon Dec 06 14:56:49 EST 1999 | Russ
The best way that I have found to calculate CPk for placement machines is to buy the kit that is usually provided by the manufacturer of machine. It usually consists of a glass plate and glass components that are scaled. You simply program the mach
Electronics Forum | Tue Mar 30 22:43:36 EST 1999 | dean
| Does anyone know of a contract manufacturing house that can guarantee smt component placement and can verify placement of +/-.015? | | Thanks in advance | Question: mm, inches, or mils? I can do it. However, what is your reliability level? 9
Electronics Forum | Tue Nov 03 17:28:10 EST 1998 | smd
SMTnetters: My UIC conveyors aren't working with my: Omniflow 7 Reflow (Mfg 1/95) Dek 265 GS Philips CSM What can I do? Does anyone have experience with connecting UIC or other conveyors to the above equipment? On the reflow I jumped terminals 1
Electronics Forum | Sat Jun 15 22:49:23 EDT 2002 | edahi
well as usual this for flip chip however, this application uses ceramic substrates and the nearby area in which the splatter land on is the marking area (gold pad). We cannot hide this because the package is completed bare die, meaning no heatspread
Electronics Forum | Thu Jul 25 21:41:03 EDT 2002 | davef
1.0 X-OUT POLICY 1.1 Each Panel not to contain in excess of X% X'd-Out boards. 1.2 Each X-Out board to be marked in a manner so that Pick & Place equipment will not attempt to insert those boards X'd-Out such as fiducial reference hole for paneliz
Electronics Forum | Sun Jul 28 23:11:52 EDT 2002 | caldon
Sam - If I owned Cal Driscoll Electronics and were looking for a rework system a few things I would consider: 1) Convection is key (IR as an under heater or pre heat is ok but not as the main heat source). 2)programming simple? User Friendly and easy
