Electronics Forum: 1.2m (Page 1 of 1)

RJ45 1X4 Way Connector

Electronics Forum | Tue Mar 03 03:38:58 EST 2015 | vb7007

Hi Kester 979. (No clean flux) Solder pot temp - 280 Conveyor speed - tried (1-2M) but same Thanks

Wave soldering defects

Electronics Forum | Tue Dec 27 10:18:03 EST 2016 | anhsang38

Dear Pro, I want to confirm with you about conveyor speed. is 1m/s? We are using wave soldering but it is 1.2m/min, min not second. Pls, check it agian. The flux is not relative this error. It is relative no sodering, bridge. The solder bar is the

PCB Prototypes

Electronics Forum | Thu May 06 09:15:51 EDT 1999 | Haitham Sakr

1. PCB boards coated with photoresist both Single & Double sided baords especially the double one with dimensions of 1 m square or 1/2 m square with a life guarntee not less than 3 years. > 2. Photoresist spray bottles of 200ml or more. > 3. Solder &

Re: PCB Prototypes

Electronics Forum | Thu May 06 14:22:00 EDT 1999 | Dave F

1. PCB boards coated with photoresist both Single & Double sided baords especially the double one with dimensions of 1 m square or 1/2 m square with a life guarntee not less than 3 years. | > 2. Photoresist spray bottles of 200ml or more. | > 3. Sold

PCB Prototypes

Electronics Forum | Thu May 06 09:10:44 EDT 1999 | Haitham Sakr

1. PCB boards coated with photoresist both Single & Double sided baords especially the double one with dimensions of 1 m square or 1/2 m square with a life guarntee not less than 3 years. > 2. Photoresist spray bottles of 200ml or more. > 3. Solder &

Question on Nitrogen Consumption during Reflow

Electronics Forum | Mon Jul 02 14:47:24 EDT 2001 | gdstanton

Thanks. I saw your response to Gabby on May 23 2000. Sent a request to Christina Cotto at Reedexpo.com. She's going to send me copies of the Nepcon papers you referenced. Although, I did some guestimating and ballparked a monthly cost of $338k

Wavesoldering

Electronics Forum | Thu Apr 05 12:25:17 EDT 2001 | Adam

The Solderballs are on the botton side of the board.The solderballs are concentrated around through hole edge connectors, which have a Tin/lead finish and have lead pitch of 2.5mm, on top of this, random solderballs are occuring around test points. T

Re: More informations on water clean for CSP/BGA package

Electronics Forum | Wed Oct 06 03:58:25 EDT 1999 | Brian

| | Hi, | | | | Help! Could anyone help to enlighten me on this? | | | | Question: | | | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z that using a n

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