Electronics Forum | Tue Mar 25 11:48:10 EST 2003 | ksfacinelli
David, I am with you on the redesign recommendation except we are building a certified piece of equipment that cannot be easily altered. We have given recommendations for the future manufacturability but as we in manufacturing are all to aware thes
Electronics Forum | Thu Apr 03 10:33:53 EST 2003 | pjc
There was a preview (not released for sale) of the next-generation MPM Rheo Pump at the Cookson Electronics booth at APEX. Its pretty much a complete re-design. Major improvement in performance, maintenance and material conservation. Contact your loc
Electronics Forum | Fri Mar 28 13:12:10 EST 2003 | barryg
We are going to be using a no-clean paste (smt)and no clean wave solder flux on a small pcb we will be doing here soon. As far as the wave process, should i purchase a new fluxer stone for the no-clean. Should I also purchse the recommended thinner o
Electronics Forum | Thu Apr 10 15:20:35 EDT 2003 | MA/NY DDave
Hi DaveyF, Thanks You see, you proved my point, with piles of more information than I gave. Based on Application rather than design and manufacturing specifications, a lower IPC class can out perform another. So our starting Poster must look at t
Electronics Forum | Wed Apr 09 10:17:28 EDT 2003 | ksfacinelli
http://picturecenter.kodak.com/share?invite=ZExr4tzrmmYeI5Uozhlo Here is a link to the pictures. This is a HASL board with ws-609 paste. Lead parts look good but would like to see a shinner joint in the BGA area. Thermal profile looks good 150-15
Electronics Forum | Thu Apr 10 11:57:19 EDT 2003 | stepheno
We recently had to replace some BGA's. The replacement ones did not work, and when removed there was residue. Unfortuneatly I didn't get a chance to see the residue. It was described as "fuzzy and grungy". The pads had been cleaned with solder wi
Electronics Forum | Thu Apr 17 10:21:53 EDT 2003 | davef
First thing to try is get the solder connection hotter. 210*C is just not warm enough for the 'high' tin content of this connection. Second, it's disconcerning that you don't have good plating on the pad or the terminal. Why can't your board suppl
Electronics Forum | Fri Apr 18 10:45:34 EDT 2003 | tsongshe
I'm sure the parts and solder paste are well registered. these transistors are commonly to252 package,and sometimes to263 package.I 've a picture of these two diffrent kinds of pad patterns of to252,but i don't know how to post it here... Thanks ®ard
Electronics Forum | Fri May 30 18:30:32 EDT 2003 | russ
Okay, Okay, I will convert to the metric system. I would still rather say 1 mm instead of 10 microns. As far as paste how about "really little" and "really really little" (type 3 and 4 respectively) This term (micron)is good for people unlike me t
Electronics Forum | Mon Apr 28 16:36:11 EDT 2003 | razor
Component: Termination (barrier) NI, 120/3.0 um Solder Plate (outer) 90% Sn, 10% Pb, 120/3.0 um Solder: Multicore CR39, 95.5%Sn/3.8%Ag/.7%Cu @ 6mil Flex PCB: Cu, Ni, Au .2m to .5m Thanks
winsouce.jpg)
.gif)
