Electronics Forum | Wed Sep 17 15:34:17 EDT 2003 | Stephen
How about a sonic vibrator of some sort? Can't see it working in real life but who knows what someone with too much time on their hands might come up with. Stephen
Electronics Forum | Thu Sep 18 07:38:50 EDT 2003 | cmiller
That was the method we were going to try. We have the circuitry from a sifter we make. The sifter works with a regular speaker but I could not find one working at a high enough temp for an oven. Then I lost interest or got busy.
Electronics Forum | Mon Sep 22 13:18:59 EDT 2003 | pjc
I remember reading something about that a while back. The paper said vibration created a higher percentage of voids in solder joints.
Electronics Forum | Wed Sep 17 11:16:36 EDT 2003 | mantis
Hi all, With regards to the recent thread about jumping sot23.I was wondering if there are any white papers or technical articles on the phenomon of outgassing tantalum capacitors. Regards, Mantis
Electronics Forum | Wed Sep 17 15:44:28 EDT 2003 | davef
Look here: http://nepp.nasa.gov/DocUploads/CE5125B5-E0EB-4CFA-8867BE3F3E342CA5/moisture%20effect%20Ta%202C%20M.pdf
Electronics Forum | Fri Sep 19 12:58:26 EDT 2003 | russ
You most likely have a raw fab problem, These PCBs need to be baked. We have this same thing now and then (only from one supplier) and baking has helped. I hope this is what your problem is. Russ
Electronics Forum | Fri Sep 19 13:55:05 EDT 2003 | joeherz
Russ, I feel a little better now.... Baking specs...... Can you give me a tip on where to look? It's a 4 layer, .062 and roughly 5 inches square. Thanks.
Electronics Forum | Fri Sep 19 12:55:33 EDT 2003 | russ
We usually use a pad that is the same size as the ball. And use a stencil thickness of 7+ mils. Why the teardrop? Russ
Electronics Forum | Sat Sep 20 11:24:27 EDT 2003 | Gabriele
Few questions: - wich type of C-CGA ? (CAST or CLASP column to ceramic attach) - column pitch ? - column count ? - capped (with lid) ? or capless (c4 die on top)? - PCB board zize and thickness ? - volume of solder paste ? - Clean or not Clean so
Electronics Forum | Mon Sep 22 02:15:09 EDT 2003 | chrissieneale
We were having void problems with heat transfer down the via's (24 layer boards, shed loads of planes). So we drew the via away from the centre into a teardrop pad. Void's gone!
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