Electronics Forum | Fri Feb 17 14:32:53 EST 2006 | gipos
Hi all, The question for experienced operators: DEK 260 or DEK 265, which one is more suitable for high mix low volume to mate Juki 700 series line ? Is there any specific known issues regarding service, operation, repeatability... ? We have target
Electronics Forum | Wed Aug 23 17:06:40 EDT 2000 | Dr. Ning-Cheng Lee
For 20 mil pitch pads, the volume control is more critical in terms of bridging concern. In general, solder paste for dispensing is more prone to slumping due to low metal load and low viscosity. If the volume dispensed is on the high end, or if the
Electronics Forum | Thu Aug 24 13:31:41 EDT 2000 | Dr. Ning-Cheng Lee
For 20 mil pitch applications, two important properties to evaluate are (1) dispensing volume consistency, (2) slump performance. As to the dispensing equipment, positive displacement will be the better choice for better consistency. Nozzle size is v
Electronics Forum | Tue Mar 19 00:14:47 EST 2002 | ianchan
Hi Guys, Can anyone help us out here, please? We need to know what formulae (other than Length(L)xBreath(B)xheight(Z)), is used to determine what volume of paste is required for 20mils pitch leadless chip carrier (LCC28), for the paste printing pro
Electronics Forum | Fri Aug 01 00:40:06 EDT 2008 | roc2x
thanks,my pad design is 24 x 23 mils and now I chnged my stencil to 24 x 20 mils ship inwrds to lower down my volume. My placement is and part data are ok. My reflow N2 is using 1000ppm, Actual is 700-800ppm I already prolonged my pre-heat butit only
Electronics Forum | Wed Apr 14 23:16:07 EDT 1999 | wil allen
| Need to know from your experience a set of smt equipment for low volume manufacturing (approx. 800K parts/yr). Types to handle are standards i.e., 0404-7343, soic's, plcc's, pqfp, tsop, soj, BGA, chip res. smt conn. | I would like to know a recomm
Electronics Forum | Sun Jun 10 11:08:26 EDT 2001 | nifhail
I know that there is no pre-defined strength for the solder joint as it will depend on solder volume deposited, pad geometry, lead component's lead solderability etc. but, what would be the best ball park for the good joint for 0402, 0603, 20 mil pti
Electronics Forum | Tue Mar 27 08:49:57 EDT 2007 | slthomas
If by 15 mil accuracy you're looking to place 15 or 16 mil pitch, yeah, you're asking a lot of a IVc. Ours do OK for 20 mil pitch but I wouldn't want my living to depend on placing high volume ultra fine pitch with it. They're not designed for that.
Electronics Forum | Fri Sep 10 13:50:24 EDT 1999 | Jose RG
We have a product, with various PWBs, with over 600 parts each one (We are a low Volume/high mix company with an average component placement per PCB between 250 to 300 parts). This PWBs have 7 to 10, 20 mils pitch parts. We are having problems with o
Electronics Forum | Fri Sep 10 14:29:48 EDT 1999 | Doug Philbrick
| We have a product, with various PWBs, with over 600 parts each one (We are a low Volume/high mix company with an average component placement per PCB between 250 to 300 parts). This PWBs have 7 to 10, 20 mils pitch parts. We are having problems with
