Electronics Forum | Wed Dec 11 09:41:26 EST 2002 | davef
I'd guess that you need to sit at your current 216-218*C peak for that 5 to 10 seconds that I mentioned earlier. Increasing your peak is the easiest way to do that, as you say.
Electronics Forum | Tue Jun 01 19:25:19 EDT 2004 | Ken
...oops part 2: I will assume a sac 350 ball??? 217-218C this will completely reflow the ball and form a "normalized" joint with a collapsed structure.
Electronics Forum | Fri Nov 25 05:16:44 EST 2016 | slavek
Hello, I want to ask on suitable temperature profile for PCBs with ENIG final surface finish. I know that it is complex question with many unknowns. When the PCB will be standard 1,5 mm 35/35 Cu and the amount of components will have any influence o
Electronics Forum | Mon Jun 27 10:45:31 EDT 2005 | franciscoioc
Thank's for the information Bob. I have another question, at the moment my peak reflow is at 218c, this means I am above the 210c a lot of companies run off. If I am building boards using SN63/37 solder paste with lead on my process, and using lead f
Electronics Forum | Wed Apr 14 20:24:48 EDT 2004 | Ken
What do you mean the solder must "survive" 260C? What is your target temperature? Is it dictated by a component, the substrate or the solder alloy? Do you require a eutectic alloy? If not, the selection of alloys grows. (these are from memory...n
Electronics Forum | Thu Mar 12 06:37:48 EDT 2009 | gregoryyork
I agree you are too cold for the profile get it up to 230C and possibly allow it to dwell a little longer in preheat as opposed to pushing up the reflow zone only. Sn90/Pb10 melts at 220C so 2C hotter than your profile so you are reliant on it alloyi
Electronics Forum | Fri Jul 28 14:34:13 EDT 2000 | Gary Simbulan
Belive it or not, these boards were run through a Centech batch mode Vapor Phase machine. Single stage top side IR preheat. Vapor temp 218 C. Solder paste is an SN62 RMA.The boards were FR4 8 layer w/ solder mask, fairly conventional as might be e
Electronics Forum | Mon Jul 30 21:29:34 EDT 2001 | kennyhktan
Hello Michael & All, Thanks for the feedback. Months ago we receive a number of reject concerning one of the 0805 & 0603 chip capacitor mising (with joint remain on pad)and seriously solder joint fracture. From there I had do some investigation
Electronics Forum | Wed Dec 19 09:56:20 EST 2001 | guicho_v
I'm new in SMT world, and I've got my 1st challenge: I'm having de-wetting issues with a specific IC 160 pins MQFP (six location, failure is random), where one pin has de-wetting (solder reflow OK, and there is evidence of having contact the past and
Electronics Forum | Mon Feb 03 22:48:00 EST 2003 | vinesh
Hi all, We are using small CSPs (10x10mm) in one of our products which has a big ground pad in the center (7x7mm). The maximum voiding allowed on this big pad is also no greater than 25% which we are finding very hard to achieve. The centre pad ha
