Electronics Forum: 4 mil[0] (Page 1 of 1)

Step-up stencil: recommendation thickness

Electronics Forum | Tue Aug 20 21:39:29 EDT 2019 | sssamw

6 mil (0.15mm) for the 1.13mm pitch BGA, and 4 mil (0.1mm) for the smal QFN with 0.4mm pitch.

screen printer from MPM

Electronics Forum | Fri Feb 06 15:52:18 EST 2004 | pjc

SPM is superior in terms of technology and application. SPM has larger print area, up to 20� x 19", vs. 17.7� x 15.7� for the MicroFlex. MicroFlex is microprocessor controlled while the SPM has a PC. SPM can print down to 12mil (0.3mm) fine pitch no

screen printer comparision

Electronics Forum | Mon Apr 19 15:27:05 EDT 2004 | pjc

The MicroFlex is not really new. Its the UltraPrint 100 re-engineered and improved. UltraPrint 100 / SMTech 100 has been around for many years. I don't believe the DEK 248 offers a Stencil Wiper option. I worked on MicroFlex machines. Vision system i

pcb manufacturing

Electronics Forum | Wed Jan 13 04:27:00 EST 2016 | crystalpcb

Hi Here is our factory production capability: Shenze Electronic PCB Specification Layer Count 1 to 35 Layers Material Brand Shengyi,KB,GRACE,ISOLA,Rogers,Taconic,ARLLON,Bergquist Base Material FR-4(TG135,TG150,TG170,TG180),Halogen Free FR-4,Ceramic

Solder Ball Criteria

Electronics Forum | Tue Mar 17 07:32:10 EDT 2009 | davef

Solder ball acceptance: IPC-A-610, 6.5.3.1 & 12.4.10. Solder balls: 5 ball system: * No more than 5 balls per square inch (100mm2) allowed * Solder balls can not be greater than 5 mil (0.005in) (100um) * Solder balls cannot be less than 5 mil (100um)

Re: Use of solder paste for leaded thru-hole parts?????

Electronics Forum | Tue Jul 07 12:52:02 EDT 1998 | Upinder Singh

Thanks Earl. Well following is the data regarding the product. 1. The panel consists of 21 boards. 2. The surface I mentioned would have 3 SMds and 1 T/hole connector. 3. PCB thickness is 55 mils and the width of the hole on the PCB for the thru-

Stencil for BGA re-balling

Electronics Forum | Tue Nov 11 09:19:17 EST 2008 | davef

By the way you asked the question, we assume that by "reballing" you mean bumping, we should be able to figure that out: * Volume of the ball = ( pi*d^�)/6 = [355/113] *0.6*0.6*0.6]/6 = 0.11mm^3 * Volume of solder required = 2*volume of ball = 2*0.11

Re: Aperture sizes for printing SMD adhesive

Electronics Forum | Mon Feb 22 12:04:15 EST 1999 | Dave F

| Please could you suggest a recommended aperture sizes for | printing of smd adhesives. Any recommendations on stencil thickness as well as stencil finish will be appreciated. | Mark: About the only rule of printing adhesives is: Keep it off the

Re: Use of solder paste for leaded thru hole parts????

Electronics Forum | Mon Jul 06 13:17:50 EDT 1998 | Upinder Singh

| | Hi all . | | Thanks to Ryan, Brian , Justin and Dave for the timely help earlier. | | I would appreciate if somebody could help me in the stated issue: | | I am trying to to place one thru hole 20 pin connector along with the SMT components by p

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