Electronics Forum: 4 mils foil (Page 1 of 67)

Re: Mechanical stencil foil tensioning

Electronics Forum | Sun Mar 07 13:10:15 EST 1999 | Sam Sangani

| Has anyone used the mechanical stencil foil tensioning system from certain company that eliminates using stencil frames and epoxy & mesh? Any comments on whether it's worth looking into? We go through product revisions like we go through clean so

Re: Mechanical stencil foil tensioning

Electronics Forum | Fri Feb 26 04:02:16 EST 1999 | Terry Keen

| Has anyone used the mechanical stencil foil tensioning system from certain company that eliminates using stencil frames and epoxy & mesh? Any comments on whether it's worth looking into? We go through product revisions like we go through clean so

Re: Mechanical stencil foil tensioning

Electronics Forum | Thu Feb 25 04:24:15 EST 1999 | Charles Stringer

| | Has anyone used the mechanical stencil foil tensioning system from certain company that eliminates using stencil frames and epoxy & mesh? Any comments on whether it's worth looking into? We go through product revisions like we go through clean

Type 4 solder paste

Electronics Forum | Thu Apr 29 17:35:17 EDT 2004 | Shinmoto

Hi there, We place FBGA packages on a lot of our memory modules. Our stencils have .013" square apertures and a .005" foil thickness. We are using a type 4 paste from Senju Comtek. The price difference is not that significant and readily available

Type 4 solder paste

Electronics Forum | Thu Apr 29 11:07:03 EDT 2004 | arcandspark

You are right about the very poor support for smaller customers. I had told them we were looking for another paste and now they have sent the reginal manager and the US sales manager has come by to see what they can do for us. All they keep saying is

Type 4 solder paste

Electronics Forum | Tue Apr 13 08:25:15 EDT 2004 | arcandspark

I would have gone to a .004" stencil but again, the board designers, which we have no control over or are we allowed to give input to, have made the pads on all connectors and many other parts so small that we are almost seeing insuffecient solder us

Why 50 mils in 0805 package instead of 40 mils.

Electronics Forum | Fri Oct 03 09:00:18 EDT 2003 | davef

EIA standard packages have a variety of L/W proportions. EIA||Dimension mm (LXW)||Proportion (L/W) 0201||0.6X0.3||2 0202||0.5X0.5||1 0303||0.8X0.8||1 0402||1.0X0.5||2 0504||1.25X1.0||1.25 ||1.4X1.4||1 0603||1.6X0.8||2 0805||2.0X1.25||1.6 1111||2.8X2

4 mil epoxy dot dispensing

Electronics Forum | Wed May 20 05:50:08 EDT 2020 | tima

Hello colleagues, Question. Who ever done 4 mil (100uM) electro conductive epoxy dispensing? is it even possible? I did 6 mil but very unstable results... Now I need 4 mil for an application.

4 mil epoxy dot dispensing

Electronics Forum | Thu Jun 25 10:56:48 EDT 2020 | kumarb

Hi. Contact PVA in the US. Our company has been a supplier to them for many years to date for the adapters used in their machines. This is their vertical. Hope this helps.

type 3 vs type 4 paste

Electronics Forum | Thu Nov 07 09:23:05 EST 2002 | russ

What would the considerations be in utilizing a type 4 paste as opposed to type 3? We have an assembly that has a large amount of uBGAs (12 mil diam pad)along with 50 mil pitch BGAs assorted fine pitch etc... We are experiencing difficulty in paste

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