Electronics Forum | Tue Apr 28 21:48:50 EDT 2009 | davef
Confirm the source of the issue. Run a coalescence test on both lots of paste. A simple coalescence test can quickly determine the condition of solder paste after prolonged use. Simply print a small disk [around 4-5mm diameter and 0.2mm thick - a bu
Electronics Forum | Thu Feb 17 22:30:09 EST 2000 | Dave F
Alberto: There's no rules, but it works sorta like this: RESISTORS Usually marked in ohms using a standard code: First two numbers is the value Third number is the multiplier 102 = 1.0 x 10� ohm = 1000 ohm = 1 kW CAPACITOR Usually not marked. When
Electronics Forum | Thu Feb 17 22:30:09 EST 2000 | Dave F
Alberto: There's no rules, but it works sorta like this: RESISTORS Usually marked in ohms using a standard code: First two numbers is the value Third number is the multiplier 102 = 1.0 x 10� ohm = 1000 ohm = 1 kW CAPACITOR Usually not marked. When
Electronics Forum | Wed Jan 31 11:53:39 EST 2001 | rocky1
Looking for another source beside Omega! We buy the Omega brand 5SC-TT-K-36-36. Omega's lead-time on this stuff is 4-5 weeks. Can anyone help?
Electronics Forum | Thu Sep 16 03:53:04 EDT 1999 | park kyung sam
Can you imagine that there is a smt process using the a few chip and ic are nearly about 4,5,6,8 years old. Antigues?? what should you do If you are an engineer of smt process in that company. thank in advance.
Electronics Forum | Wed Mar 26 15:46:43 EST 2003 | Ren�
To remove or Place a BGA in a BGA reworks machine , do I have to do a same profile as a normal Oven ( around 4.5 mins to Peak time ) or the conditions are only to get temperature needed to Solder or Remove ( no matters Time).
Electronics Forum | Mon Apr 07 11:39:55 EDT 2003 | russ
How thick is your stencil? We print 16mil every day with type 3 paste 2 of which you have tried (Alpha and Kester) Stencil should be 5 mil. Russ
Electronics Forum | Wed Jul 30 23:16:01 EDT 2003 | praveen
The profile is enclosed.The PBGA is 37x37 mm.I am keeping the gap about 4-5 mm.The profile meets the solder paste spec.Peak temp is 211 deg C,Above melting point 77 sec. rate of heating
Electronics Forum | Wed Sep 15 22:43:24 EDT 2004 | davef
Just to help convince those on the fence that we don't know dip: 2221A, 4.5.1 tells you the vias have to be tented on both sides.
Electronics Forum | Fri Oct 14 08:12:48 EDT 2005 | lyrtech
For LUPO: speed: 4.5 inch alloy: 63Sn/37Pb Solder pot temperature: 500 Quantity of flux: just to wet the board
.gif)
winsouce.jpg)
