Electronics Forum | Mon Apr 03 11:30:39 EDT 2006 | SJ
Duckman, That's a very good point. The issue is that 8.0 has AML which is one feature that we're particularly interested in. Also I still am not sure what's the lesser of the evils, having to deal with the bugs in a new release, or having to upgrade
Electronics Forum | Wed Sep 19 21:04:57 EDT 2007 | wailiang81
Hi,davef, thanks for your concern. The condition was the pasted printed off with around 0.8~0.9mm from the land pattern. This will easy observe at QFP area. At fiducial, the stencil seens aligned accurately. Once solder bridge happend, its easy to
Electronics Forum | Thu Jul 07 23:43:31 EDT 2022 | tey422
We been using the Sayaka SAM-CT23Q machine to depanel PCB, it was fine. But now, we have to depanel the Aluminum PCBs the current bits from IMPEC we are using are not strong enough (1.5x8.0 diamond downcut). Need to find much strong bit or bits des
Electronics Forum | Wed Apr 10 11:46:28 EDT 2002 | mlovett
I would like to know the Stated Specification for PTH size tolerances. Or is there a generalised acceptable limit?. We have some PCB's with hole sizes that I consider to be way off what I would deem acceptable, ie Finished hole size should be 0.89mm
Electronics Forum | Tue Nov 02 08:57:36 EST 1999 | Kevin DuCasse
This is our first time out processing material with a finished thickness less than the standard 0.062 FR-4 material. We have an assembly that uses GIL MC5 with a finished thickness of 0.035 and we are having difficulty at placment with the array "bo
Electronics Forum | Fri Aug 14 09:37:36 EDT 1998 | Earl Moon
| Where can I find a spec to put on my fab drawing, to call out the cleanliness of the board, before I recieve it. These boards will require a tight spec after they are assembled, so I want to know that they are clean when I get them. Any suggestions
Electronics Forum | Thu Jul 17 04:42:47 EDT 2003 | sanjeevc
Hi! One technique: 1. Remove all balls 2.Make > a mask(stensil)for reballing.The holes of the > mask must be 0.8-0.9 the size of the pads. 3. > Reball chips 4. Reflow chips Good luck Hi Yes,we have done quite a bit of reballing of BGAs with
Electronics Forum | Thu Jun 29 02:16:07 EDT 2006 | AR
We are experiencing some difficulties with reflow soldering a 1210-sized MOV with silver/palladium finish. The PCB finish is SAC. When inspecting the board after reflow it seems that nearly all solder is gone both from the pads and the component term
Electronics Forum | Tue Sep 14 00:35:47 EDT 2010 | sachu_70
The PPS helps to prepare a program off-line without affecting on-line production. However, there are certain efforts that we must consider, such as identifying the part orientation on feeder vis-a-vis its placement orienation on PCB, and confirming s
Electronics Forum | Wed Jun 18 03:19:34 EDT 2014 | edriansyah
Hi All. I'd like to do a little benchmark with you all regarding regarding the reflow speed. What is your highest reflow speed? My own experience is 8.0 m/minutes using a 10 zone reflow machine. Conditions: Mix boards (not only chip components, bu
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