Electronics Forum | Wed Mar 31 21:57:21 EST 2004 | pdeuel
Minor problem with rejected parts on a GSM C4 single flex head. UIC support was helpfull but I thought some of you may have encountered this problem and know what's the matter. We are rejecting 1 out of 3 SOT-63 parts. The problem is occuring to part
Electronics Forum | Sun Sep 19 10:54:24 EDT 2004 | rohman23
This (along w/ everything else we do) is not high volume. Actually, we're dropping a batch of 7 the first of the week, and that's fairly sizeable for us. I talked with my stencil design folks and sent them a scrap board and all my gerber info. I t
Electronics Forum | Tue Aug 28 08:28:30 EDT 2012 | rgduval
We agree with all of the previous comments, and would add the following: Warpage is generally caused by excess moisture in the raw boards. Have you tried baking the boards prior to assembly? We had this issue on a simple 4-layer board, and found t
Electronics Forum | Wed May 29 07:41:33 EDT 2024 | tommy_magyar
We use the same component on many different products, never faced a similar issue. However, things I would check are: - stencil thickness (ideally 125um) - additional Z move on the parts around the relay (as suggested by kumarb) - check the packages
Electronics Forum | Sun Dec 09 22:54:20 EST 2001 | dburr
It sound you have already discovered to root cause, flux entrapment in the via holes. Short of changing the desing, here are sone suggestions. The main thing is you have to dry out the via holes of the wet flux. Some things to try are: slow down t
Electronics Forum | Fri Oct 08 16:36:28 EDT 1999 | Glenn Robertson
| We've recently encountered this problem where one of our .050" pitch BGA's were reflowing at the wave thus causing shorts... The board was profiled with probes stuck to a QFP solder joint, an 0603, and one of the BGA joints. There was an almost 7
Electronics Forum | Fri Oct 08 16:36:59 EDT 1999 | Dave F
| We've recently encountered this problem where one of our .050" pitch BGA's were reflowing at the wave thus causing shorts... The board was profiled with probes stuck to a QFP solder joint, an 0603, and one of the BGA joints. There was an almost 7
Electronics Forum | Fri Jan 15 11:33:46 EST 1999 | Bob Willis
| Hello, | | We are qualifying new sources of PWB vendors. We've got the first lot of "produciton" boards in and we want to put them through the paces before turing the vendors on. | | So far, the tests I can think of performing, and that we have
Electronics Forum | Sun Oct 10 17:50:00 EDT 1999 | JohnW
| | We've recently encountered this problem where one of our .050" pitch BGA's were reflowing at the wave thus causing shorts... The board was profiled with probes stuck to a QFP solder joint, an 0603, and one of the BGA joints. There was an almost
Electronics Forum | Thu Apr 05 12:25:17 EDT 2001 | Adam
The Solderballs are on the botton side of the board.The solderballs are concentrated around through hole edge connectors, which have a Tin/lead finish and have lead pitch of 2.5mm, on top of this, random solderballs are occuring around test points. T
