Electronics Forum: analog devices soic marking (Page 1 of 1)

Removing Markings from Devices

Electronics Forum | Tue Apr 29 11:18:16 EDT 2008 | bandjwet

All: I am interested in how process engineers are both removing and adding markings to active devices. We have a job where we have to both remove the markings of and the re-mark SOICs. The markings on the devices look like they are pad or ink jet p

SMT-5000 Capability

Electronics Forum | Wed Dec 05 13:19:23 EST 2012 | markcsi

We have an SMT-5000 that we have been using for many years, but up till now the smallest device was SOIC, SOT23 type devices. Now I have designed a board that has a 24 pin TQFN-EP device and a 10 pin LFCSP_W device. I am concerned that this is be

MIRTEC AOI

Electronics Forum | Tue Nov 05 08:17:54 EST 2013 | bdamico

Hello Irene, My name is Brian D'Amico, I am the president of MIRTEC USA. I noticed your posting on this forum and I would like to offer some guidance. First, I would like to ask which camera is installed on your machines. The MV-2HTL could either b

Re: Paste Printing @ 45 degrees

Electronics Forum | Sat Aug 14 01:21:29 EDT 1999 | Dean

| | Has anybody adopted the method of stencil printing with the board at a 45 degree angle to the squeegee blade? What are the benefits and drawbacks? I've heard you get better fine pitch results. | | | | TX | | Mark | | | I have used thetechni

Re: Paste Printing @ 45 degrees

Electronics Forum | Tue Aug 17 10:21:32 EDT 1999 | Steve A

It may be worth mentioning to those that do not have the ability to rotate the PCB, that some folks adjust their aperture design on fine pitch leads by increasing the aperture size for those leads parallel to the X axis, thus allowing consistent volu

Re: DFM / DFT information

Electronics Forum | Thu Jul 13 22:20:38 EDT 2000 | Dave F

=10 mils larger than lead 3 silk screen legend text weight >=10 mils 4 pads >=15 mils larger than finished hole sizes 5 place through hole components on 50 mil grid 6 no silk screen legend text over vias (if vias not solder masked) or holes 7 so

Re: Drying ICs any advice

Electronics Forum | Fri May 15 17:31:04 EDT 1998 | Steve Abrahamson

| | | | We had some failures on an IC package that the manufacturer has put down to moisture inside the package, leading to popcorning. | | | | This seems a bit odd, the package is a PLCC 84 which is quite thick. I have only seen this problem on thin

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