Electronics Forum | Thu Aug 26 04:35:54 EDT 1999 | Wolfgang Busko
| | | Does anyone have any information on stencil aperture/pad ratios for noclean solder paste. In the past I have experienced severe solder ball problems when using the same size apertures from aqueous products as I do with the No-clean products.
Electronics Forum | Wed Aug 25 17:09:53 EDT 1999 | Earl Moon
| | Does anyone have any information on stencil aperture/pad ratios for noclean solder paste. In the past I have experienced severe solder ball problems when using the same size apertures from aqueous products as I do with the No-clean products. Co
Electronics Forum | Wed Aug 25 15:51:58 EDT 1999 | JohnW
| Does anyone have any information on stencil aperture/pad ratios for noclean solder paste. In the past I have experienced severe solder ball problems when using the same size apertures from aqueous products as I do with the No-clean products. Cons
Electronics Forum | Fri Aug 27 13:31:47 EDT 1999 | swsng
1.5 FATOR FOR 20MILS QFP REDUCE 2 MILS HEEL AND INCREASE 2MIL AT TOES AT SIDES -1MILS EACH. SWSNG
Electronics Forum | Mon Apr 14 17:41:21 EDT 2008 | janz
Hello, That is working for us. If you have a look at the Indium or Cookson recommendation they are very similar. Just make few diffrent patterns of the BGA and find out what is workin for you. Regards Jan
Electronics Forum | Thu May 01 09:19:59 EDT 2003 | davef
ehess Why do YOU want to block apertures to keep solder from pads?
Electronics Forum | Thu May 01 07:17:35 EDT 2003 | davef
Why not fill the apertures with paste and let the paste dry-out? We have found that a hammer and chisel are very effective for removing dried paste.
Electronics Forum | Mon Apr 28 09:53:10 EDT 2003 | kmorris
I've got a set of apertures on a stencil that I would like to "plug" or block off. In the past we've done this with Kapton tape, but since this location is close to a fine pitch component, the thickness of the tape prevents good gasketing at the fin
Electronics Forum | Thu May 01 13:56:45 EDT 2003 | kmorris
Dave: After the stencil was made with apertures for a connector on this PCB, it was discovered that the connector would have to be handsoldered after SMT reflow. If the solder deposits are left to reflow on the pads, it makes it difficult for the o
Electronics Forum | Sun Dec 12 09:10:44 EST 1999 | Jerry
What the D Pak stencil?
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