Electronics Forum | Mon May 16 15:53:17 EDT 2005 | adrian_nishimoto
This has been a problem with new components coming directly from vacuum sealed desiccant packed moisture barrier bags with moisture level cards. We have also baked all boards prior to the BGA rework to ensure no moisture issues were addressed.
Electronics Forum | Fri Jan 22 17:38:07 EST 1999 | Michael Larsen
| | I was just wondering what solutions are out there for dry storage. Our basic need is to be able to store boards that have been baked and need to remain moisture free for up to a week. | | | Michael: Let's take a different angle on this. Why
Electronics Forum | Wed Jun 08 12:30:38 EDT 2016 | deanm
Lead forming can provide retention during wave soldering. There is the simple offset method, the dimple and compound forms. All of these are outlined in IPC-AJ-820A. It would probably require automated lead forming equipment using special dies. GPD m
Electronics Forum | Mon Feb 01 10:06:51 EST 1999 | Chris Fontaine
All of our moisture sensitive components are shipped to us in vacuum sealed, desiccated bags with a moisture indicator. When the parts are removed from the bag (this is done at either SMT setup, or in the stockroom) the indicator is checked. If it
Electronics Forum | Thu Nov 03 08:34:25 EST 2005 | Slaine
Hi We currently use a small amount of Alloy : 43Sn 43Pb 14Bi Flux: RMA-51AC, Metal : 88.5%. We use it for reworking a product and only consume about 100g per year, we are in the middle or ordering in some more paste but the MOQ is 500g. Is it possibl
Electronics Forum | Wed Apr 25 17:44:05 EDT 2007 | Cmiller
WOW, just no innovation here. Nobody thought to sick some suction cup thinggys to is so it can place parts too and a little dispenser so it can put down paste and yea, an old convection rework wand and wow, we can do SMT and AOI. GOD, what was I thin
Electronics Forum | Thu May 08 11:58:12 EDT 2003 | fmonette
Hi Chrissie, This might be old news to you but I just wanted to make sure that you are aware of all the implications of BGA rework relative to the control of moisture-sensitive components. For example, you need to keep track of the total exposure t
Electronics Forum | Mon Mar 19 08:56:17 EST 2001 | fmonette
One very important consideration in your situation is to determine if you have moisture sensitive components on these boards. If you have any device classified level 3 or higher then you have a very high level of risk associated with moisture sensit
Electronics Forum | Wed Mar 14 11:51:24 EST 2001 | fmonette
Popcorning is the common designation for defects related to the moiture sensitivity of plastic molded components, like PBGAs. The plastic body of these parts will absorb moisture from the ambiant atmosphere on your factory floor. If a critical level
Electronics Forum | Tue May 26 11:11:59 EDT 1998 | Steve Gregory
Hi Peter, There's been a lot of discussion on this topic lately (baking parts), and that got me reading the IPC-SM-786A, which is pretty good. For your first question, the parts absorb moisture over time. The type of package mold compound
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