Electronics Forum | Tue Sep 03 18:14:35 EDT 2002 | fmonette
I have never heard about a requirement for temperature ramp-up for baking components at 125C. In general the concern for delamination with moisture sensitive components starts above 200C (peak body temp). Most important is you should bake your com
Electronics Forum | Fri Aug 10 15:46:07 EDT 2001 | davef
Probably, but the fabricator of these components can best respond to this question. The need to bake depends on the component design. J-STD-020 and J-STD-033 [as I recall] relate to moisture sensitive components and define 6 classes of moisture sen
Electronics Forum | Fri Oct 04 11:34:42 EDT 2002 | Bob Willis
Some additional comments from a paper may be of interest. Baking Printed Circuit Boards - Why and How Baking printed boards prior to conventional and surface mount assembly should not be necessary. Often boards are baked for historical reasons; in
Electronics Forum | Mon Aug 13 17:38:05 EDT 2001 | fmonette
Praveen, Once you find out the MS level of your components, you will need to track the exposure time from when the parts are initially removed from their dry bags, through test, programming, taping, and during subsequent dry storage and use of thes
Electronics Forum | Wed Oct 02 20:59:23 EDT 2002 | davef
We�ve been stewing on this and it just dawned on us the part that�s missing. Blow-holing is caused by BOTH of the following: * Moisture absorption by the resin that holds the board together. [Steve is addressing this with his various baking schemes
Electronics Forum | Sat Aug 25 08:39:15 EDT 2007 | gsala
If plastic Carrier Tape (CT)/ emboss tape, is made by: a)Polycarbonate material, it can withstand temperature around 120C� or may be more mantaining original dimension. b)Polystirene material, at max 45�C-50C� the CT starts to change dimensions and
Electronics Forum | Fri Oct 27 08:53:25 EDT 2006 | russ
I thjink you should bake these parts for 24 hours at 125C I used to have this problem and I even think it was the same package to be honest. Since we started baking all BGAs for rework process regardless of "condition of storage" we have increased
Electronics Forum | Wed Jun 24 18:50:31 EDT 2020 | premkumar_haribabu
Dear experts, We are in stage to fix lapse or hold time between pre-bake to reflow process ( SMT ) for flex-rigid PCB, usually for flex pcb , we need to assemble as early as possible once after baking & if not , we can store in humidifier up to some
Electronics Forum | Mon May 13 20:40:07 EDT 2002 | davef
Fine pitch parts are not the issue. Platic parts that absorb moisture are the issue. Search the fine SMTnet Archives to get started. Try: * MSD * Moisture sentive device * Dessicant cabinets * Baking times * 033 * 020 * etc
Electronics Forum | Wed Sep 05 16:35:22 EDT 2012 | davef
It depends, but I'd guess that as a minimum the floor clock will start when the component returns to room temperature. It's easy to argue that the floor clock starts earlier than that!!! Probably, the floor clock starts a couple degrees lower than th
