Electronics Forum: baking waffle tray (Page 6 of 12)

Baking components at 70 degree

Electronics Forum | Wed Dec 19 15:12:25 EST 2007 | slthomas

I see. You might request that those parts be provided in the proper trays (125�) for starters, but I do understand the issues with contract assembly. I'd be inclined to write a program to pick them from that tray and place them into a proper one. Wh

Re: Baking Components ?

Electronics Forum | Fri Jul 30 17:26:02 EDT 1999 | John Thorup

| | Surface Mount Components like QFP's in Tray usually comes sealed in an anti-static plastic pack. In case the QFP's were removed from the said anti-static bag for more than 2 weeks, do these components needed to be baked for they might produce so

fine pitch/BGA component handling

Electronics Forum | Wed Dec 18 20:08:36 EST 2002 | jonfox

Are your components not in JEDEC trays? We use Kostat trays and we can bake our parts at or up to 150C. What are your temperature requirements, and what are your parts currently being stored in or on? There are a slew of tray makers out there that

SMT Disasters

Electronics Forum | Mon Jul 07 09:00:50 EDT 2008 | josh_brubaker

These images are of two melted matrix trays, full of BGA components, which were left to bake in an oven over the weekend. The oven temperature controller was not checked after a recent power failure and reached a temperature of 715�F. The two trays m

placements per hour

Electronics Forum | Thu Feb 16 11:54:53 EST 2006 | jobbie

Hi jax Have checked actual assemby time against machine up time and have a figure of 5440cph which seems to be ok from what others are saying. Its just the utilization that i need to sort but this is difficult with the resources/restrictions that i

Strange things ocuring during reflow...

Electronics Forum | Thu Feb 25 20:25:16 EST 2010 | dean

Good question, the answer as of right now is yes. Our machine is only able to go down to 0402 parts before the surface tension of the solder begins to cause issues with maintaining the placement position of the part on the nozzle. However, we are dev

Quad IVc AutoProgram

Electronics Forum | Mon Apr 01 17:02:58 EDT 2013 | microaide

Yes! Thank you. That was not intuitively obvious, nor did the manual make that point clear at all. I can now create new SMD Types. Now if I just had the foggiest idea on how to set up and assign feeders, I might be able to generate my program. Right

QUAD 4C Laser problem

Electronics Forum | Fri Sep 06 10:27:42 EDT 2013 | nophsem

Hi bobpan! MOD CODE 69 is "Waffle Tray Handler Installed Flag" and default setting 0. That's what mode code quick reference table says (the reference table that I've to respect according to the previous owner). And it's different what manual says (M

Using RoHS Components in a leaded paste world

Electronics Forum | Thu Oct 31 11:54:10 EDT 2013 | ke6zoy

I work in a leaded paste world due to aerospace environmental requirements. There are a few cases where parts are only available from suppliers as RoHS. Can anyone recommend how to process these into a leaded assembly? Is it just reflowing at a hi

Re: Component Baking

Electronics Forum | Tue Oct 19 23:17:48 EDT 1999 | Stu Leech

I answered another post regarding the subject of demoisturizing bake-out. Our new process works for taped and reeled devices as well as those in trays. Stu Leech


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