Electronics Forum: baking waffle tray (Page 7 of 12)

Baking components at 70 degree

Electronics Forum | Wed Dec 19 14:02:18 EST 2007 | gersla

We decided to bake components in tray package at 70 Degree prior soldering. I am looking for suggestion regarding baking time for MSL3 components: Up to 1.4mm package thickness 1.4-2 mm thickness 2-4.5 mm thickness In JEDEC-033B this temperature is n

fine pitch/BGA component handling

Electronics Forum | Thu Dec 19 11:30:11 EST 2002 | russ

What temp. are you planning on baking them? If this is long term process I would recommend that you hav trays made out of an appropriate ESDS material that can withstand your bake temp (such as duropol)for your QFPs. You can have several patterns/pa

No such thing as a Compact Reflow Oven?

Electronics Forum | Tue Mar 20 03:55:38 EDT 2018 | rob

MTC = Multi tray changer. It's a stand alone unit that feeds in trays of components - it means you don't sacrifice feeder locations to waffle packs. Different companies call them different things. A 760 is dog slow, and spares are getting harder to

Baking components at 70 degree

Electronics Forum | Thu Dec 20 10:23:12 EST 2007 | slthomas

You could have said "why don't you just flop 'em over twice into the right tray?" lol. Yeah, that's the right way. I was kind of focused on what I had to do here to get two different parts from full trays into two cut-in-half-the-long-way trays sinc

Re: QFP "leg straightener"

Electronics Forum | Thu Sep 10 15:41:59 EDT 1998 | Chrys

| Is a machine available to straighten QFP legs | Where? | How much? | Anygood? Ben, Texas Instruments makes a way cool machine for straightening bent QPF leads. It's totally automatic. It'll pick'em out of waffle trays, do a vision inspect for, "t

Baked Components

Electronics Forum | Thu Aug 15 22:35:54 EDT 2002 | Brandon

I've done some experiments on baking parts as we got pop corning QFP's on our production line. This QFP has moisture level of 5 and I baked them @ 125'C for minimum of 12 hrs. So far results were great but I have a question: Forum says that I cannot

Moisture sensitive components (MSC)

Electronics Forum | Tue Feb 20 16:33:08 EST 2001 | davef

Time, time, time. There just never seems to be enough!!! Eh? You�re correct. Depending on the material, some trays can take a high temperature bake, while other trays, in addition to tubes, and reels, require a low temperature bake. With this la

BGA Baking & Tape and Reel Issue

Electronics Forum | Tue Sep 14 07:54:05 EDT 2004 | modwyer

Folks, At the moment I bake all BGA that are in unsealed trays, to reduce moisture etc. Is this common practice or are there particular manufacturuers that cause more problems. Also, the tape for BGA tape & reel has a hole in the tape (as is normal

BGA replacement process

Electronics Forum | Tue Sep 09 16:00:07 EDT 2008 | ppcbs

We always bake our loaded boards before any BGA rework is done. 12 to 16 hours at 100 c. We have had incidents in the past on loaded boards where 125 c has melted parts and the occasional low temp BGA trays. 100 c has proven safe for the past 10 y

Feeder tape size

Electronics Forum | Fri Sep 27 15:07:50 EDT 2002 | barryg

Genny, you may want to look at the brds you will be running and identify the various packages. I do not know what a standard package is. Most chip resistor and capacitors, 0402, 0603, 1206, 1210's are on 8mm feeders, but ic's vary quite a bit. Also r


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