Electronics Forum: baking waffle tray (Page 9 of 12)

Baking components at 70 degree

Electronics Forum | Wed Dec 19 14:41:47 EST 2007 | gersla

Dear Steve. We are EMS company and we are getting wide range of components from our customers. Some of them came in trays, that can withstand up to 75 degree maximum. If someone will not pay attention to this the tray get damaged (if there is some Q

Solder beading with PCB from different fab

Electronics Forum | Wed Apr 06 04:18:03 EDT 2011 | emmanueldavid

TK, Hope you got it right only for this round of assemblies. Well, passing through a Reflow belt is not an ultimate process to dry circuit cards & take out moisture from Solder finished layers. First of all, if the packs were not unsealed (even s

Baking components at 70 degree

Electronics Forum | Mon Jan 07 13:09:35 EST 2008 | stevek

As I told you, some carriers (trays) are limited > to 75 degree maximum, and from time to time > employees do not pay attention to this. This is > one of the reasons. The second reason is that 90 > degree still be problematic in a case of rebake

MSL | Baking components after expired floor life

Electronics Forum | Mon Sep 12 20:24:26 EDT 2022 | stephendo

I'll answer the easy part. If you put low temperature trays in the oven at 120C, they will warp and partially melt. I have seen it more often with reels of LEDs. Someone is told to bake them before use so the put them in the batch oven and the next

Re: BGA Warp

Electronics Forum | Wed Sep 29 07:28:04 EDT 1999 | Wolfgang Busko

3�C/min) or maximum temperature (~240-250�C)." For the correct handling of moisture sensitive devices and prebaking advices see IPC-SM-786A or newer publikations. I encountered the following: A tray of sample BGAs was send to me proper packed and se

Baking time for PCBA rework

Electronics Forum | Wed Feb 06 19:28:43 EST 2002 | sleech

I agree with Francois. We have just announced a 55 deg. C LTVP drying process that can greatly speed moisture removal. It is also effective for drying components that remain in tape and reel, conductive plastic shipping tubes or trays. Process time

Baking requirement

Electronics Forum | Thu Apr 11 14:20:29 EDT 2002 | sleech

We have just introduced a new drying process that operates at only 55 deg. C and has proven to be able to drive moisture from tape and reeled devices or compontents in shipping tubes as effectively or more effectively as a convection oven at 125 deg

Baking planars after new BGA placed.

Electronics Forum | Mon Aug 14 20:37:03 EDT 2006 | davef

JEDEC defines packaging, matrix trays, tape and reel, and like whatnot. You need to be searching ANSI and IPC. Find these documents: * ANSI/J-STD-020, Moisture/Reflow Sensitivity Classification for Plastic Integrated Circuit Surface Mount Devices *

Do yo have to bake unused bare boards or just Vacuum Pack?

Electronics Forum | Sun Aug 27 20:30:53 EDT 2006 | darby

AJ, We use all ENIG boards. After opening, any remaining boards are kept in low humidity keeping cabinet. I have never experienced a problem using this method I think the longest I have kept them this way is eighteen months. We also store any open tr

Baking components at 70 degree

Electronics Forum | Thu Dec 20 01:22:41 EST 2007 | gersla

As I told you, some carriers (trays) are limited to 75 degree maximum, and from time to time employees do not pay attention to this. This is one of the reasons. The second reason is that 90 degree still be problematic in a case of rebake more then 3


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