Electronics Forum | Thu Dec 04 10:59:02 EST 2014 | rrosera
HI, I work for a company in New England and recently had a unusually large number of boards fail after replacing a BGA on them. We use a AirVac DRS25 to remove and replace the BGA witch uses local forced hot air. We usually have at least a 90% s
Electronics Forum | Tue May 19 08:20:10 EDT 2009 | Mity C
Good Morning, We are underfilling some of our BGA's. This is a specified customer requirement. The material we are using is Emerson & Cuming E-1216 (also specified by the customer) The material was selected because of a close CTE match with the PCB.
Electronics Forum | Fri Dec 05 10:09:36 EST 2014 | robl
Hi Rob, Could be moisture getting into the boards or the BGAs or it could be drafts messing with the thermocouples measuring the heat at board level meaning you over cook it. Are you pre-baking the PCBAs & the BGAs before reworking and replacing?
Electronics Forum | Mon Feb 12 10:02:18 EST 2007 | rgduval
A little late to the party here, sorry... Has the joint been verified as a cold solder joint? That is, visually confirmed that it looks like cold solder, and, perhaps, xrayed to confirm the solder status? X-raying may sound a bit extreme, but you'
Electronics Forum | Mon Dec 15 18:22:36 EST 2014 | mcapizzi
As was stated, there are a number of variables that could come into play. I have used AirVac DRS26 and SRT Machines. We are now using Shuttle Star which has IR as well as hot air heat. This works much better for us. You can view these at. http://www.
Electronics Forum | Fri Dec 05 13:57:37 EST 2014 | emeto
Hi, Do you observe any part warping in the corners? Do you X-ray 3D? I really doubt that all joints are fine and the part wouldn't work, but if so, your problem should be part related.If you have a temperature controlled facility I wouldn't even thi
Electronics Forum | Sat Jul 02 06:19:01 EDT 2005 | Dhanish
My customer feedback they found one board with cold solder on the BGA ball.I looked at the picture,the ball looks very shining but I dont think that is a cold solder.What is the method can be used to confirm the colde solder beside cross sectioning t
Electronics Forum | Fri Dec 27 17:18:37 EST 2024 | SMTA-71155914
It sounds like the lower BGA isn’t getting enough heat during the reflow process, likely due to the upper component in the PoP assembly blocking some of the heat. First, double-check the thermal profile to make sure it matches the solder paste specs—
Electronics Forum | Wed Aug 11 07:20:33 EDT 2004 | gregoryyork
HASL Fluids are generally not RA based fluxes. They are generally fluxes based on hydrochloric acid or hydrobromic acid or a mixture of the two, plus some very strong wetting agents that are very hygroscopic. Doesn't the residue of hydrochloric go wh
Electronics Forum | Wed Nov 21 09:19:09 EST 2007 | Paul M.
Need some opinions from you fine folks. We are building assemblies 90% SMT, 10% TH. Fine pitch and BGA devices, etc. The customer is complaining about cold solder joints (SMT) after about 1 year of use, scattered thru-out the assembly, not consistan
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