Electronics Forum | Thu Sep 24 09:25:24 EDT 2009 | davef
What do you mean by "substrate?" Is it: * Semiconductor die * BT circuit board interposer Is the BGA package: * Encapsulated * Mounted on a circuit board
Electronics Forum | Thu Jun 18 14:25:21 EDT 2020 | sara_pcb
We have observed Plastic BGA crack in encapsulation to substrate interface. After reflow, the device was not functioning. The Crack is observed in the fresh lot during visual inspection. What is the attachment process of package to substrate? where c
Electronics Forum | Fri Nov 25 09:31:56 EST 2005 | davef
pyramus, First, search the fine SMTnet Archives for previous discussions on BGA shorts. Second, we're still not clear on the issue. * Is the problem with a BGA? If so, please describe the BGA, including any heat spreader * Is the problem with a uB
Electronics Forum | Fri Aug 22 17:12:40 EDT 2003 | Stephen
read the other messages. I havn't seen this problem nor have I even heard of anyone seeing this problem. If anyone else has seen this on unreflowed BGA's I would love to hear it. At first I thought you meant that your QA department was finding the pr
Electronics Forum | Fri Jul 20 17:09:10 EDT 2001 | davef
Circuits Assembly magazine 09/99 "Defluxing with Ultrasonics" by Les Hymes. [There's more but I can't find it right now. I'll add to this as I find the junk, er very nice stuff.] J-STD-001C states that its OK to use ultrasonics for cleaning so lon
Electronics Forum | Wed Apr 05 13:59:56 EDT 2000 | Kal C.
Hi Emmanuel, There is lots of info. in SMTNet archive (I think 98 Sept-Dec). I had a lot of problem with PBGA and certain uBGA with their PCB base material (FR-X) and encapsulant. Wolfgang is correct. We had to reprofile our reflow oven , qualify an
Electronics Forum | Tue Aug 26 17:50:52 EDT 2014 | dkrawchuk
Hi, We have some boards that we apply an underfill to a BGA. Some boards have underfill that covered the surrounding passives. The customer is concerned that the different expansion rates will damage the passives. Does anyone know of a company th
Electronics Forum | Wed Oct 20 19:36:45 EDT 1999 | Dennis O'Donnell
Hi Mark: Running a wire under a BGA is possible, however if you plan to mount the BGA over the wire you would want to make sure that the wire insulation will withstand the heat of the reflow temperature. A more reliable way would be to lay a trace
Electronics Forum | Tue Jun 06 20:13:31 EDT 2000 | Dave F
Not as easy as that Bob. But this may help you get started ... IC packaging materials include: � Silicone - Room temperature vulcanized silicone - Heat curable hydrosilation silicone � Biphenol & multifunctional epoxy glob tops � Polyurethane � Pol
Electronics Forum | Wed Jan 25 17:12:41 EST 2006 | adrian_nishimoto
Billy, I think the most versatile kit out there is the RB-2000 system from Mini Micro Stencil. We have not run into a part yet that we could not reball, even ones with a raised encapsulated center. They even make custom screens that match the compo
