Electronics Forum | Thu Sep 12 01:49:28 EDT 2002 | ck
Hi all, Any stencil opening recommendation for 20mils pitch mirco BGA. Currently, using 12mils round opening, 5 mils thickness. Seen to have weak joints as it crack after Ict testing. thks
Electronics Forum | Mon Oct 13 19:04:47 EDT 2003 | davef
Aperture size should vary with the component [pitch]. That size should be the same a the pad size. So, generally pinching is not required. Indium discusses BGA apertures on their site [ http://www.indium.com ]
Electronics Forum | Mon Jun 07 13:51:48 EDT 1999 | Dave F
| | We are changing from through-hole to SMT, wondering what pitch requirements would an 8 pin SOAC require for pick and place? We think that this would be our finest pitch part. | | | | | | | John: Never heard of an "SOAC." SO packages are 50
Electronics Forum | Mon Jun 07 20:12:42 EDT 1999 | John Martell
Thanks for the advice, I'll check out that site. | | | We are changing from through-hole to SMT, wondering what pitch requirements would an 8 pin SOAC require for pick and place? We think that this would be our finest pitch part. | | | | | | | |
Electronics Forum | Thu Sep 09 04:45:02 EDT 2004 | Rob
Hi, Depends on where in the world you're based, but in the UK you can pick up a decent Universal GSM1 for around �12K-�15K ($20K-$27K). We place BGA's, huge fine pitch IC's, 72mm connectors etc with no problem. I believe they do up to 100mm feeder
Electronics Forum | Wed Sep 08 15:59:25 EDT 2004 | kbayram
Hello, I'm looking for a lower end used machine that can place a 55x44mm sized bga component, placement speed is n't concern. At the moment I have only found the quad ivc to be capable although I'm worried about the placement accuracy and repeatabi
Electronics Forum | Wed Dec 05 17:44:25 EST 2001 | LloydG
we are in the process of design, plan to use a 0.5 mm pitch BGA. does someone has a recommended footprints. thx!
Electronics Forum | Mon Feb 28 06:06:04 EST 2005 | Guest
I'm looking for recommendations on pad and stencil design for products with 0.5 mm pitch BGA's. The latest info that I found in the archives of this forum dated more than a year ago. It didn't give me much confidence that assembly of such components
Electronics Forum | Wed Mar 02 05:04:36 EST 2005 | ABHI
What is your micro BGA requiremnets? I mean ball dia / height with a 0.5 mm pitch? I can give you the stencil design, if you make known the parameters.
Electronics Forum | Tue Mar 02 10:24:06 EST 2004 | russ
I have done this before, We print with a 5-6mil stencil and have had no problems with any underneath solder. If you are still nervous instead of removing from stencil use some 3 mil kapton tape or equivelant and tape off the BGA pads. This way the
