Electronics Forum | Thu Dec 08 11:12:37 EST 2005 | diablo19delta
Hey JP, Try using I-Source for your stencils. www.i-source.com
Electronics Forum | Thu Nov 05 12:15:00 EST 1998 | Kenny Vaughn
Does anyone know of a company that reballs BGA's? Im looking for a reliable source that can do a 10/90 alloy.
Electronics Forum | Wed Apr 14 17:00:40 EDT 1999 | David
Any recommendations for a reballer for BGA and mBGA? Low volume, low cost appreciated!
Electronics Forum | Mon Nov 09 07:57:58 EST 1998 | Mark Quealy
| Does anyone know of a company that reballs BGA's? Im looking for a reliable source that can do a 10/90 alloy. | Winslow Automation in Cal. sells re-balling services as well as a line of preforms and fixtures to do it yourself. We've been re-ball
Electronics Forum | Thu May 13 19:43:57 EDT 2004 | My Nguyen
Hello all: We looking for an effective solutions for HIGH-VOLUMN BGA RE-BALLING. (i.e. cases where we got to scrap thousands of BGA modules and re-use the chip) BGA spec. (general) W: 8mm, L: 13mm, H: 1.12 mm, No. of ball: 60, Size: 0.45mm Pitch:
Electronics Forum | Wed Feb 09 15:23:14 EST 2005 | GS
Hello, few comments: - what is the criteria to decide if re-ball or not a PBGA? - any electrical test is performed toPBGAs before reball ? - what in case the reballing has been done on a electrical damaged PBGA? In that case the replacement of
Electronics Forum | Fri Jan 15 11:25:29 EST 1999 | E. R.
Does anyone have information pertaining to re-balling BGA components using balls that are preformed onto disolable paper waffers (mini BGA reballing kit)? The paper containing the specific BGA device/pattern would be placed onto the BGA then process
Electronics Forum | Fri Jan 15 14:49:32 EST 1999 | Dave F
| Does anyone have information pertaining to re-balling BGA components using balls that are preformed onto disolable paper waffers (mini BGA reballing kit)? The paper containing the specific BGA device/pattern would be placed onto the BGA then proce
Electronics Forum | Wed Jun 30 18:36:21 EDT 1999 | Mark
| Does anyone have information pertaining to re-balling BGA components using balls that are preformed onto disolable paper waffers (mini BGA reballing kit)? The paper containing the specific BGA device/pattern would be placed onto the BGA then proce
Electronics Forum | Thu Jul 07 16:46:52 EDT 2005 | adrian
I am using pretty often the re-balling Winslow Automation kit for many BGA packages we have to re-ball. When I have started doing this, I've tried to use "BGA REBALLING INSTRUCTION" manual (PR-4048 REV.F), but it didn't work. For some reason, althoug
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