Electronics Forum | Wed Sep 14 15:42:45 EDT 2011 | nowak18
During temperature cycling we have determined that the conformal coating wicking underneath our BGAs has caused fractures in our solder balls. One proposed solution is to run an RTV dam around the parameter of the BGA to prevent the CC from wicking u
Electronics Forum | Wed Aug 15 08:33:31 EDT 2012 | jdumont
Wondering if anyone has ever run across this in their travels. We have gotten a few field returns back in recent months and it appears that many of the balls of the PPC440 CPU BGA (ceramic) have shifted. I know we Xray this part 100% during assy so
Electronics Forum | Fri Jan 30 10:29:48 EST 2009 | petep
We have a potential new customer who has special PCB requirements. I do not know a lot of details at this point, but have several questions. One of their assemblies has within it , a MID, Solid foil layer, completely isolating one side of the PCB f
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