Electronics Forum | Fri Jul 06 10:18:02 EDT 2007 | blnorman
According to IPC-A-600, measling can occur in epoxy-glass boards when the moisture content of the board is above 0.3wgt%. Is this the industy acceptance standard for max moisture content of a board?
Electronics Forum | Mon Jul 16 12:03:42 EDT 2007 | davef
We're aware of no industy acceptance standard for max moisture content of a board. For more on moisture levels, get a copy of: "Removing Moisture from Electronic Components and Assemblies", CS Leech, Jr, Circuits Assembly, May 1994. The article disc
Electronics Forum | Mon Feb 11 21:54:14 EST 2002 | davef
LONG TERM Your plans to buy a vaccuum bag resealer and a batch drying oven sound good as you say, but you�re correct. They will not help with this current situation. SHORT TERM If your connections are clean, free of pits and holes with a smooth,
Electronics Forum | Mon Dec 31 09:00:06 EST 2001 | davef
Baking before assembly does nothing good. It: * Increases costs. * Adds steps to the process and makes scheduling more cumbersome. * Increases the amount corrosion on solderable surfaces. We used to bake to remove the moisture from boards that caus
Electronics Forum | Tue Oct 19 19:15:23 EDT 1999 | stephenmac
I would like to know how to measure the moisture in pcb's. I have experienced blowholes and am sure it is the board manufacturer. What is the limit and is there any way to correct the problem when moisture rich boards are already in your process. Th
Electronics Forum | Mon Dec 28 14:57:07 EST 1998 | Earl Moon
| Looking for additional handling and baking information of moisture sensitive IC'c beyond/or inadditotn to IPC - SM - 786 A. Publications, guidelines, baking experience. | Much depends on your environmental controls and those of your suppliers. PB
Electronics Forum | Tue Oct 19 22:43:31 EDT 1999 | Stu Leech
We are deeply involved with this question because we have developed a much faster way to remove moisture from PCB's. PCB's absorb varying amounts of moisture at differing rates. The rate is influenced by the laminate type board configuration , loca
Electronics Forum | Tue Apr 07 22:34:14 EDT 2009 | 1036
Board delaminated after reflow - see attached picture. Does moisture cause this problem?
Electronics Forum | Wed Apr 08 09:09:39 EDT 2009 | tommyttr
That is a delamination. It is indeed from moisture. You need to bake the boards for at least 8 hours and you should be good to go.
Electronics Forum | Wed Jan 11 14:54:36 EST 2012 | cobham1
With a large number of you out there building rigid-flex boards. I am wondering first what kind of profile do you use and what are you peak temps. I ask these questions because we are finding that our boards have a high moisture level and we are also
