Electronics Forum | Wed May 16 13:55:25 EDT 2001 | davef
Urethane and parylene have the best long term humidity resistance of the conformal coatings. Since yer not hep about urethane, try the parylene [http://www.paratronix.com/apps/, http://www.paryleneinc.com/, http://www.parylene.com/, http://www.scsco
Electronics Forum | Tue Jul 17 15:13:53 EDT 2001 | mparker
Dave - I agree that the U shape for QFP's sounds a bit whacked, for the reasons you state. It may work OK for larger pitchs but then again there are a myriad of fixes that work before resorting to U shapes. With the U shape removing paste from under
Electronics Forum | Sat Dec 04 09:23:20 EST 1999 | Christopher Lampron
Kantesh, Does this particular part have a heat sink across the bottom side of the component and does your pad size and stencil aperture match the component? I have just had a very similar problem with a DPAK. What we found was that the recomended pad
Electronics Forum | Tue Nov 16 14:10:30 EST 1999 | Bill Schreiber
According to a paper by Richard Clouthier, published in 1996, there are two major factors about normal cleaning chemistries that may affect stencil adhesives. 1) Elevated temperature above 110 degrees F. (45 degrees C). Stencil adhesives are heat c
Electronics Forum | Sat Sep 04 06:01:49 EDT 1999 | Earl Moon
| Dear sirs, | | If you have experienced Proflow of DEK screen printer, please let me know the details of it. | | Best regards, | | Jame Bond | | James, Stir, don't shake is not good advice for cleaning proflo heads. This thing works great, bu
Electronics Forum | Sat Sep 04 07:11:34 EDT 1999 | JohnW
| | Dear sirs, | | | | If you have experienced Proflow of DEK screen printer, please let me know the details of it. | | | | Best regards, | | | | Jame Bond | | | | | James, | | Stir, don't shake is not good advice for cleaning proflo heads. Th
Electronics Forum | Mon Jun 07 11:21:38 EDT 1999 | Brian Wycoff
| | I need to perform shear tests on components that have been glued prior to wave soldering. Can any one recommend a shear tester and some standardized info on testing? We have had problems with poor glue bonds and would like to implement a test m
Electronics Forum | Wed Nov 25 21:23:29 EST 1998 | Dave F
| I like to know under what conditions the reflow profile of a solder paste is taken? Bare board, board with the solder paste, or board with high melt solder paste? | John: None of the above. The two key variables that determine the reflow tempera
Electronics Forum | Thu Oct 15 17:29:29 EDT 1998 | Christopher L.
| We have a need to bond Flatpack and Quadpack components to the circuit board. The adhesive should be quick curing, repairable and have a low modulus. It does not have to be thermally conductive (but it would be a plus). The components are current
Electronics Forum | Thu Oct 15 21:19:21 EDT 1998 | Scott McKee
| We have a need to bond Flatpack and Quadpack components to the circuit board. The adhesive should be quick curing, repairable and have a low modulus. It does not have to be thermally conductive (but it would be a plus). The components are current
