Electronics Forum | Thu Nov 07 10:07:02 EST 2019 | charliedci
Requesting help from anyone with experience in reflowing Te Connect, PN 1565917-4, 200 pin connecter. Pic attached. Cannot get all 200 pins to wet, main suspect is slight PCB warping during reflow. Have adjusted reflow profile. A 2.75 inch long SMT c
Electronics Forum | Thu Nov 07 21:28:31 EST 2019 | sssamw
The connector is so long, and has big metal parts, it will be little deformed during reflow I guess, andthe pins planarity should be critical for 200 pins. Did you measure the non wetting pins profile to see if temperature ok? And maybe you can try u
Electronics Forum | Fri Nov 08 05:40:54 EST 2019 | leeg
We place these on a few boards and have no issues with reflow or warpage. How thick is your PCB?
Electronics Forum | Fri Nov 08 14:45:12 EST 2019 | charliedci
Appreciate the input from everyone. The PCB is .062" thick. As a CM we are at the mercy of our customer at this point although (hopefully) they are receptive to advice on the next build. Titanium strips could be an option, I also thought there might
Electronics Forum | Fri Nov 08 14:19:59 EST 2019 | dwl
You can try putting titanium stiffeners on the PCB to prevent it from warping. How thick is your stencil? More paste would give you a wider window however too much and you risk bridging. You could try over printing the pad at the heel and toe to get
Electronics Forum | Tue Jul 27 16:08:04 EDT 1999 | Kathleen at ATL
I'm working on a prototype board that requires a 600 pin BGA. This is a metal top BGA being placed on a 11" x 17" PCB about .62" thick. The part is 1.77" square with a 50 mil pitch and 30 mil bump diameter. The bumps are located on the perime
Electronics Forum | Tue Feb 15 09:27:34 EST 2000 | Casey Scheu
Sal, This is a common problem experienced by several OEM's. It all comes down to heat. This is why the problem is corrected on your repair unit. I would suggest using a Slim Kic or Data Pac (mole) to thermal couple the IC prior to the reflow oven.
Electronics Forum | Sat Feb 12 09:08:47 EST 2000 | Sal
Experiencing a problem with a 208 PBGA device. I am achieving good wetting with the exception of one ( damn) pin on the outer corner.I have a really good profile but the worrying thing is that it is so inconsistant. Once this open pin failure is dete
Electronics Forum | Fri Aug 21 17:34:53 EDT 2009 | rajz
Need a help from friend, I got a issue that we face a defect that solder on nexlev pin after reflow owen.
Electronics Forum | Tue Aug 25 20:46:39 EDT 2009 | davef
We need more information and possibly a picture in order to help you.
