Electronics Forum: bridge components 3d soo (Page 1 of 1)

3D xray

Electronics Forum | Thu May 31 11:07:23 EDT 2007 | pjc

ICT and AXI are two different methods for MDA. ICT checks component values and polarity- component and circuit electrical testing while AXI checks solder joints- volume, voids, bridging, etc.... Typically, AXI is in the SMT process engineering and QA

Inspection Machine Capability

Electronics Forum | Wed May 09 03:29:16 EDT 2001 | Eyal Duzy

Yes, your observation is accurate. Different process steps have different inspection requirements which necessitates employing different imaging technology to ensure the best performance (detection and throughput). Orbotech, for example, offers both

AOI ( automated optical inspection) benchmark

Electronics Forum | Tue Feb 19 13:37:48 EST 2002 | PeteC

When evaluating AOI you must first define what type of inspections you want the system to perform, pre-solder or post-solder. What separates many mfgs. of these systems is how effective they are at finding post solder defects. This is where camera re

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