Electronics Forum | Mon Nov 27 17:50:01 EST 2000 | Dave F
Mike: It gets more humid in the winter? [I can see it�s true (not that I�d doubt you) cause I�m looking a a humidy map of the USA, right now] How does that work outin Californy? [Do the ocean breezes move the humid air in-land in the summer? Er w
Electronics Forum | Fri Feb 22 00:25:46 EST 2002 | Jones
There appears to be less of a blade sticking out of the holder than the MPM set up. Thats something we noticed recently. We have our mechanical attack angle set at 0 degrees right now, but we are in the process of changing this setting by 5 degrees t
Electronics Forum | Tue Aug 15 17:17:27 EDT 2006 | flipit
Anyone who uses Pepto-Bismol is drinking Bismuth. In the early 90s the Dept of Defense banned Antimony in solder but later repealed the ban. I drained the waves and the hot air solder leveler and replaced the solder with "No Antimony" solder. Ther
Electronics Forum | Mon Jan 22 21:24:33 EST 2001 | edger_w
Hi! Mike My company is using the electric dry box and it can controlled less than 10% within 2.5 hours if we are not going to open the door. In normal working environment and it still can't control around 30%. Is it something that you are looking
Electronics Forum | Thu Jul 15 12:35:19 EDT 1999 | Earl Moon
| I use a Transition Automation Semi- Automatic stencil printer with laser cut frameless stencils. My solder paste is an SN63/PB37 RMA 291. I do not operate with in a controlled humidity enviroment. The room temp generally runs around 70 deg's but hu
Electronics Forum | Thu Jul 15 14:09:23 EDT 1999 | MMurphy
| | I use a Transition Automation Semi- Automatic stencil printer with laser cut frameless stencils. My solder paste is an SN63/PB37 RMA 291. I do not operate with in a controlled humidity enviroment. The room temp generally runs around 70 deg's but
Electronics Forum | Tue Jul 20 07:56:38 EDT 1999 | Mark Quealy
| | | I use a Transition Automation Semi- Automatic stencil printer with laser cut frameless stencils. My solder paste is an SN63/PB37 RMA 291. I do not operate with in a controlled humidity enviroment. The room temp generally runs around 70 deg's bu
Electronics Forum | Sat Jan 20 20:54:03 EST 2001 | fmonette
Dear Mike, As you might have noticed from the labels on the dry bags, the maximum floor life is specified by the component manufacturer and it can range from 1 year (level 2) down to a few hours after mandatory bake (level 6). This limit is based o
Electronics Forum | Wed Jun 27 21:05:48 EDT 2001 | davef
BGA Cycle 1: solder ball attach. BGA Cycle 2: BGA attach to board. BGA Cycle 3: BGA removal from board. BGA Cycle 4: BGA pad dress. BGA Cycle 5: BGA ball replacement. BGA Cycle 6: BGA re-attach to board. Board Cycle 1: BGA attach to board. Boar
Electronics Forum | Tue May 26 11:11:59 EDT 1998 | Steve Gregory
Hi Peter, There's been a lot of discussion on this topic lately (baking parts), and that got me reading the IPC-SM-786A, which is pretty good. For your first question, the parts absorb moisture over time. The type of package mold compound
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