Electronics Forum | Sat Oct 09 09:07:48 EDT 1999 | Brian
| | | Can anyone tell me the formula/method to determine | | | the amount of weight that solder's surface tension can support. | | | (ie: Maximum weight of components soldered onto a bottom side | | | of a board during a top side reflow on a Paste/Pa
Electronics Forum | Sat Oct 09 09:18:21 EDT 1999 | Dave F
| | | | Can anyone tell me the formula/method to determine | | | | the amount of weight that solder's surface tension can support. | | | | (ie: Maximum weight of components soldered onto a bottom side | | | | of a board during a top side reflow on a
Electronics Forum | Tue Oct 12 05:09:13 EDT 1999 | Brian
| | | | | | | Can anyone tell me the formula/method to determine | | | | | | | the amount of weight that solder's surface tension can support. | | | | | | | (ie: Maximum weight of components soldered onto a bottom side | | | | | | | of a board during
Electronics Forum | Sat Oct 09 10:30:24 EDT 1999 | bix
| | | | | Can anyone tell me the formula/method to determine | | | | | the amount of weight that solder's surface tension can support. | | | | | (ie: Maximum weight of components soldered onto a bottom side | | | | | of a board during a top side refl
Electronics Forum | Mon Oct 11 12:49:11 EDT 1999 | John Thorup
| | | | | | Can anyone tell me the formula/method to determine | | | | | | the amount of weight that solder's surface tension can support. | | | | | | (ie: Maximum weight of components soldered onto a bottom side | | | | | | of a board during a top s
Electronics Forum | Sat Oct 09 04:17:21 EDT 1999 | Brian
| Can anyone tell me the formula/method to determine | the amount of weight that solder's surface tension can support. | (ie: Maximum weight of components soldered onto a bottom side | of a board during a top side reflow on a Paste/Paste process). |
Electronics Forum | Sat Oct 09 07:33:23 EDT 1999 | Dave F
| | Can anyone tell me the formula/method to determine | | the amount of weight that solder's surface tension can support. | | (ie: Maximum weight of components soldered onto a bottom side | | of a board during a top side reflow on a Paste/Paste proc
Electronics Forum | Tue Sep 12 07:15:33 EDT 2006 | bwet
I have a thought question for you SMT process engineers out there. We are attempting to have a part selectively drop off in a reflow oven on a 2-sided l-f SMT assembly. In order for this to happen we will have to make sure during the reflow cycle th
Electronics Forum | Sat Apr 26 20:27:18 EDT 2003 | LWEI
I'm working on a protobuild for a pcba. THis pcba uses double-reflow, paste-in-hole process. On bottom side there is a Ceramic BGA, size 35 X 35 mm, thickness 6mm, over 900 balls count (ball pitch 1mm)and it weighs a hefty 20 grams. Printing uses 6 m
Electronics Forum | Tue Sep 19 09:44:16 EDT 2006 | billyd
Tom Clifford over at Lockheed put out a great Gold calculator. It works quite well in finding where you should be abd where you actually are with gold content. Is there any type of heat sink being applied to the device? Something that maybe gets scre
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