Electronics Forum | Mon Dec 02 16:25:06 EST 2002 | jimlew
In doing process qualifications for 0201 caps, has anyone taken cross-sections and discovered cracks / hairline fractures / voids between the metalization on the end and the ceramic itself? (not cracks in the solder joint) We are well within the cap
Electronics Forum | Wed Dec 04 21:39:53 EST 2002 | davef
As you say, some BIG time force has pulled the metalization from the bottom of the component termination. From the pix it's hard to say whether it was caused by either: * Mechanical flexure of the board during an unusual heating or other processing
Electronics Forum | Fri Jun 25 05:34:40 EDT 2010 | ppcbs
Hi iv40 Try with NIC ceramic capacitor that was tested in wet process. We hav succeed with these cap after we found some failure with Kemet ceramic Cap which tested in dry test process while manufacturing.
Electronics Forum | Mon Jun 21 02:15:03 EDT 2010 | ppcbs
We also encountered the crack case in multi layer Ceramic Cap,0603 after touch up. Most failure were on the terminals. Previously, we used 0805 instead 0603.that time, failure were very few.
Electronics Forum | Sat Jun 19 08:32:49 EDT 2010 | davef
Please describe the location and appearance of the crack
Electronics Forum | Mon Jun 21 12:02:36 EDT 2010 | roland_grenier
check your de-panelling process if you are using break-out tabs or V scoring.
Electronics Forum | Sun Jun 27 22:25:51 EDT 2010 | leadthree
*** silly question deleted, there are no 100nF NPO ***
Electronics Forum | Sat Jun 19 00:49:17 EDT 2010 | mun4o
Hi all, lately ofen I have problem with cracked ceramic capacitors.We use 0805 and 0603 cap. Samsung.ICT measure diferent capacity of nominal.If I tray to desoldering component , then component cracked.I think , that the reason is the moisture in com
Electronics Forum | Fri Jun 25 08:38:37 EDT 2010 | mun4o
Thanks, Dennis. That is a good idea, but I have problem :) - our logistic department lookig for cheap components...What other mnfg of cap you use? Regards,
Electronics Forum | Mon Jul 12 00:23:02 EDT 2010 | leadthree
I had cracking caps from the ICT and a variation in the length of the probes (due to wear and tear) that press down the PCB. That put lots of mechanical stress on the PCB. So have also a close look at the ICT, or another other test fixtures you use.
