Electronics Forum | Sat Jun 19 00:49:17 EDT 2010 | mun4o
Hi all, lately ofen I have problem with cracked ceramic capacitors.We use 0805 and 0603 cap. Samsung.ICT measure diferent capacity of nominal.If I tray to desoldering component , then component cracked.I think , that the reason is the moisture in com
Electronics Forum | Thu Feb 03 04:55:21 EST 2005 | Dougs
OK, component wide portion runs with the conveyor, so really both sides should heat and cool at the same rate. The crack is at the termination between end cap and ceramic body and run vertically up the end cap, so when we remove the cap it comes of
Electronics Forum | Tue Jun 22 08:37:52 EDT 2010 | davef
Dennis: These "terminal detach failures" probably are caused by thermal shocking of the components. * Preheat the components * Use a hot air pencil rather than a soldering iron
Electronics Forum | Wed Jun 23 08:47:32 EDT 2010 | mun4o
Hi, about location - components are in the diferent location on PCB.In the one PCB have 7 cap 560pF 0603 , and some of thenm are cracked, another are OK. When I look at 20x microscope , I can't see defect, but ICT measure from 200 to 350pf.When hea
Electronics Forum | Fri Apr 11 11:26:09 EDT 2003 | Brian W.
Cracked capacitors usually are not found at ICT. Unless the cap is completely cracked, the capacitance may not change much, and the usual failure mode is a leakage current. This is usually only seen in ESS type testing, when temperature and humidit
Electronics Forum | Thu Feb 03 07:39:24 EST 2005 | davef
The component orientation was just for the calculation. It has no affect on what you're seeing. As an alternate explanation, it's possible that difference in temperature is causing the board to flex in the z-direction [as you say, it may not be f
Electronics Forum | Wed Feb 02 08:51:25 EST 2005 | Dougs
we have a capacitor cracking on one of our boards, there are four of the same cap on the board and only one cracks, we are seeing about 6% of the component cracking. it's not near the edges of the board and he board is 2.4mm thick so i dont think it
Electronics Forum | Thu Apr 10 19:19:01 EDT 2003 | stevemoore
Are you gluing the parts to the board? We had a similar situation where the glue beneath the component would add a 'fulcrum' point to the center of the device and when the board flexed the part would fracture.
Electronics Forum | Sat Feb 05 13:25:32 EST 2005 | etienne
Just a basic suggestion.... Inspect the nozzle placing the component...because that is the only medium, apart from the PCB design, which can be causing the damage. It occurred in my Department.
Electronics Forum | Fri Jun 25 08:38:37 EDT 2010 | mun4o
Thanks, Dennis. That is a good idea, but I have problem :) - our logistic department lookig for cheap components...What other mnfg of cap you use? Regards,
