Electronics Forum | Thu Apr 23 07:51:45 EDT 2009 | scottp
Every paper I've seen published shows that BGA voids either have no effect or actually give a slight improvement. The one exception are voids with a root cause in bad incoming boards, such as champagne voiding where nearly the entire interface is go
Electronics Forum | Fri Dec 03 12:17:18 EST 2004 | Dreamsniper
Hi, I was told that there is a reliability problem with a 30 to 50 percent champagne voiding on chip components. What is this? first time I've heard this terminology. can you help me? regards,
Electronics Forum | Wed Dec 08 11:29:48 EST 2004 | Marcus
Hi, champagne voiding is the term for small flux enclosures in a solder joint. Under X-ray that looks like the bubbles in a champangne glass. Marcus
Electronics Forum | Fri Dec 03 12:27:41 EST 2004 | mruzicka
I did a quick search and ran across this: www.nepcon.co.uk/files/pt_kbryant.pdf You can also look here http://listserv.ipc.org/scripts/wa.exe?A1=ind0411&L=technet post #32.
Electronics Forum | Fri Dec 03 13:08:40 EST 2004 | Dreamsniper
The voids are between the interface of the pad and the solder joint of component chips. I have a good thermal profile and this problem occured only on certain product so since we have some common components, component termination contamination is no
Electronics Forum | Thu Mar 02 09:23:05 EST 2006 | Bob R.
I never understood the statement "process indicator". The 7095 committee used that wording but didn't explain it. Other than really unusual cases such as champagne voiding, BGA voids are not a reliability issue. A half dozen studies have come to t
Electronics Forum | Wed May 22 19:10:47 EDT 2013 | anvil1021
We do a lot of these devices and I guess I am not familiar the term "Dry Solder". The QFN device is not designed to have a drain hole, but needs to have thermal vias to control heat in most cases. We have used every possible gnd pad design and modifi
Electronics Forum | Mon Jun 26 23:33:20 EDT 2006 | KEN
We saw this condition over 3 years ago. It sometimes is called "champagne bubbles". The intemetalic formation is interrupted due to the micro voiding reducing mechanical strength. I discovered this on lead free test vehicles for a major computer
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