Electronics Forum | Mon Oct 31 20:35:58 EST 2005 | milroyperera
If I brief shifting, I checked the component before it enter the reflow oven and saw that the IC is perfectly aligned on the pads but when it comes out from the oven the IC is floated on the pads. The floating is irregular and the IC is shifted away
Electronics Forum | Mon Mar 03 23:24:06 EST 2008 | Mag10
I have a project to evaluate solderability of various metals or plated finish. I'd like to tap in to get some advise. The project is to evaluate solderability of various metals or plated finishes for RF shield application with reflow. Due to the hig
Electronics Forum | Thu Oct 18 11:59:38 EDT 2012 | jackofallmasterofnone
1) At this time we do not have a design engineer. I have contacted the PCB manufacturer about changing the drill file to close up the diameter on the holes a bit. This should allow the wings on the leads of the component to rest on top of the holes i
Electronics Forum | Tue May 26 07:46:26 EDT 1998 | Peter H. Cote
We currently bake plastic SMT parts in accordance with the IPC guidelines for moisture sensitive parts. Because we have double-sided boards that are subjected to either an aqueous or semi-aqueous cleaning process, we do a 24 hour bake at 125 deg. C
Electronics Forum | Tue May 29 16:52:07 EDT 2001 | hussman
By far the easiest way is to track solder paste measurement on your board - or solder defects after reflow (key word- easiest). Why spend 2 weeks examining a stencil when it clearly doesn't make defects, or IS making defects. I find using 2-D data
Electronics Forum | Sat Jun 17 09:09:15 EDT 2000 | Chrys Shea
Contact the adhesive manufacturer, or their website. Most adhesive suppliers offer two cure options - one with a belt oven profile and one with a box oven profile. The belt oven is usually a ramp and plateau of 120-150C for approx 2 minutes. The b
Electronics Forum | Tue May 26 14:42:55 EDT 1998 | Justin Medernach
| We currently bake plastic SMT parts in accordance with the IPC guidelines for moisture sensitive parts. Because we have double-sided boards that are subjected to either an aqueous or semi-aqueous cleaning process, we do a 24 hour bake at 125 deg.
Electronics Forum | Tue May 26 15:49:05 EDT 1998 | Earl Moon
| | We currently bake plastic SMT parts in accordance with the IPC guidelines for moisture sensitive parts. Because we have double-sided boards that are subjected to either an aqueous or semi-aqueous cleaning process, we do a 24 hour bake at 125 deg
Electronics Forum | Tue May 26 12:19:53 EDT 1998 | Earl Moon
| We currently bake plastic SMT parts in accordance with the IPC guidelines for moisture sensitive parts. Because we have double-sided boards that are subjected to either an aqueous or semi-aqueous cleaning process, we do a 24 hour bake at 125 deg.
Electronics Forum | Wed Apr 21 00:35:31 EDT 1999 | Scott Cook
| Netters, | | When I reflow a PCB there is a discoloration of silkscreen and mask. It appears if Profile is too hot! But I dont think so, maybe I'm wrong? | | 1. Kester 293 no clean | 2. 2.1 C/s for 30s to 150 C | 3. .5 - .7 C/s for 60s to 185
