Electronics Forum | Mon Apr 13 18:18:31 EDT 2020 | wbrenner
Does any one have a general cost percent going from class 2 to class 3 for the same Assembly.. Or, general up charge percent when biding class 2 vs class 3?
Electronics Forum | Tue Apr 14 08:58:45 EDT 2020 | emeto
Charge them double
Electronics Forum | Mon May 04 10:06:49 EDT 2020 | davef
Some Class 3 customers don't want their products to be comingled in assembly processes with Class 2 products.
Electronics Forum | Mon May 04 06:31:50 EDT 2020 | jandon
Are you capable of doing Class 3 products? Does the design, bare PCB board and assembly meet the requirements of Class 3?
Electronics Forum | Wed Apr 15 04:08:14 EDT 2020 | SMTA-Davandran
Study on process flow. Charge base on additional effort put to meet Class 3.
Electronics Forum | Mon Aug 16 13:18:46 EDT 2004 | davef
You bet our reponse changes. Q2R: Hard gold thickness is 4 to 10 u" for Au and 300 to 400 u" for nickel A2R: This is a hard gold spec?? It looks like a ENIG spec. Although, the Ni is quite heavy, 150 uin is sufficient for most applications. The gol
Electronics Forum | Fri Jul 14 16:32:55 EDT 2023 | calebcsmt
Does class 2 vs class 3 PCBs effect variance/tolerance in terms of actual positioning of pads/traces? For example, if fiducial is to be at 10mm. What's the tolerance for class 2 vs class 3? [variance allowed] Does panelization have any effect on t
Electronics Forum | Wed Sep 08 10:32:39 EDT 2004 | C Lampron
Good Day Everyone, I have a Class 3 medical customer where we are seeing solder balls adjacent to the fine pitch device leads post reflow. We are processing these with OA so small amounts of solder balls usually wash of at clean. These however, are
Electronics Forum | Mon Oct 05 14:38:03 EDT 2015 | deanm
We are planning on using a chip that is available in LGA or Sn/Pb balled BGA. The package dimensions are the same. Pitch = 1.27mm. We are using a Sn/Pb soldering process and no clean paste (wash afterward) for high reliability Class 3 assemblies. Fai
Electronics Forum | Thu Oct 08 15:15:49 EDT 2015 | huske
BGA's are by far much easier to process correctly and inspect. As for LGA's you'll never get 100% of the materiel out from under it during the cleaning process. The voiding issue is magnified with and LGA, the low standoff is the reason for the v
