Electronics Forum: clean prior to assembly (Page 1 of 15)

Masking of PWBs prior to conformal coat

Electronics Forum | Wed Apr 19 11:50:05 EDT 2006 | amol_kane

Hi BJ, Everyone's favourite answer...it depends! If the volume if large, masking boots will save you both, time and money in the long run. Custom boots are relatively expensive to buy, but they pay themselves over time by savings on masking tape. ma

Encapsulating prior to Potting

Electronics Forum | Wed Feb 25 12:01:15 EST 2015 | jasonnova

Welcome to the world of Contract Manufacturing. Unfortunately there is not an opportunity for redesign. This is a growing customer that we are training to involve us during the design stage to avoid production issues like this. The customer would

Encapsulating prior to Potting

Electronics Forum | Wed Feb 25 11:37:01 EST 2015 | jasonnova

We have a customer with an assembly that will require potting using 3M DP-270. There is a component that needs to be covered with potting material but it is considerably higher than the overall potting height of the cavity. The low viscosity of the

Baking prior to conformal coat

Electronics Forum | Thu Jul 21 08:24:28 EDT 2005 | dougs

are you going to clean the boards prior to coating?

PCBA baking prior to rework

Electronics Forum | Mon Oct 14 18:27:38 EDT 2002 | kennyg

In regards to baking an assembly prior to hot air (BGA) rework.... 1) Do people always bake, sometimes or never? Does this depend on whether MS sensitive components are near the rework site? If a BGA is to be removed and reballed, baking is a no-br

Baking prior to conformal coat

Electronics Forum | Wed Jul 20 10:07:05 EDT 2005 | cecil

Does anyone have any input on the need to bake out an assembly prior to the conformal coat process? I understand baking out components/pwb's prior to processing through the reflow or wave solder process if the material shows excess moisture absorbtio

PCBA baking prior to rework

Electronics Forum | Tue Oct 15 10:12:44 EDT 2002 | davef

1) Do people always bake, sometimes or never? Does this depend on whether MS sensitive components are near the rework site? If a BGA is to be removed and reballed, baking is a no-brainer. Sometimes, based on the proximity of the MS components. >2)

Cleaning BGA pads prior to rework

Electronics Forum | Thu Apr 08 07:01:51 EDT 2010 | muarty

Hi, Looking for views and some opinions on the best systems to use to clean pads (particularly BGA) prior to carrying out replacement of parts. I'm thinking of vacuum type desoldering systems. Obviously braid is an option which we currently use, but

Cleaning BGA pads prior to rework

Electronics Forum | Thu Apr 08 15:27:49 EDT 2010 | davef

Fast or cheap, fast or cheap, fast or cheap ... Tough call, oh yeh, time is money. That's it!!!

Baking PWBs prior to wave solder

Electronics Forum | Mon Dec 16 15:00:56 EST 2002 | sueph

We have always baked our assembled boards prior to wave solder, but have recently learned that there are some companies out there who don't. I checked with one of my supervisors, and he said that baking is recommended but not required. I'm wonderin

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clean prior to assembly searches for Companies, Equipment, Machines, Suppliers & Information

Golden State Assembly
Golden State Assembly

Golden State is a contract manufacturer that makes wire harnesses, electromechanical assemblies (box builds, subassemblies, PCBAs, kits, etc.) and services (sorting, rework, value additive manufacturing engineering)

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