Electronics Forum | Tue Sep 24 23:02:59 EDT 2002 | redmary
For the COB process, what thickness for plating Au is suitable? IS there any specification for this issue?
Electronics Forum | Fri Sep 27 11:20:21 EDT 2002 | davef
Mar, The previous post makes the best point. Your finish spec depends on the COB process you plan to use. Is your process: * Gold wire bond * Aluminum wire bond * Flip chip * Er, watt
Electronics Forum | Fri Sep 27 10:05:07 EDT 2002 | oconnorp
I spec COB using wire bond attach - 0.75um � 0.25 Gold over 5um � 3 Nickle.
Electronics Forum | Tue Sep 24 23:03:14 EDT 2002 | redmary
we used the ball bonding, just normal chip on board. as I know the the electroless Ni/immersion Au, the gold thickness is about 0.13um at most, what about chemical plating or electrolytic plating? any experience on it, thanks
Electronics Forum | Thu May 27 09:07:16 EDT 1999 | Sergio Luiz Vito
I am Looking for more information about chip on board process (COB process) for low cost products. Someone have experiencies with this process? Thanks a lot eng. Sergio Luiz Vito Process Depto.
Electronics Forum | Wed Aug 07 10:47:02 EDT 2002 | hanson
would you like to tell me about COB Process ?TKS
Electronics Forum | Tue Nov 05 16:21:52 EST 2002 | RicardoF
Thank you Gentlemen, that info is very useful, in fact I'm on the engineering side but I just wanted to prepare a brief description of COB process and what the requirements are. Thank you again
Electronics Forum | Thu Jul 14 20:16:33 EDT 2005 | Bman
I know what the COB process is, and I have no intention of getting involved with that end of things. I need to know how to place SMT parts on a board with a COB. It looks like the preferred method is to place the SMT parts first, then go through th
Electronics Forum | Fri Oct 25 11:57:34 EDT 2002 | ricardof
Hi, I would like to know what would be the main steps to set-up a COB process? or what would be the main requirements to accomplish this? (eqipment: Die mounter, wire bondig, etc. Documentation: Certifications, etc. Plant readiness: Lay-out, eytc), I
Electronics Forum | Wed Aug 17 21:58:35 EDT 2005 | plcc
Does anyone familiar with COB process? I hv a PCBA product with one of the photodiode (size 26mmx1mm) which needs to be bonded directly on the pcb using COB technology. The wires that need to be bonded are 2, goldwires for about 100microAmp current.
