Electronics Forum | Tue Jun 12 20:47:41 EDT 2001 | ianchan
Hi mates, anyone done SMT process for micro-lead frame (flip-chip)before? Appreciate any process control caution points from the experienced guys (yonder the deep blue seas) who have done this product before. 1) pcb thickness 2) pitch-to-pitch (co
Electronics Forum | Fri Sep 19 14:11:39 EDT 2003 | Bryan Sheh
Dear all, Is there anyone who has the experience in conducting Push&Pull test for fine pitch components?i.e.SOIC,QFP. The customer clearly stated that,"every lead should be tested for selected components".but, you know that,the fine pitch,0.5 or
Electronics Forum | Thu Jun 09 07:02:02 EDT 2005 | ajaydoshi
1. We do have PCB with 0402 component, Micro BGA ( 0.5mm pitch , 0.25 mm pad size ). PCB thickness is 0.8mm. What stencil thickness we should use. PCB size 40 mm X 60 mm 2. We have EKRA E4 , What will be optimum setting for above. Pressure, Scquge s
Electronics Forum | Mon Sep 14 09:25:49 EDT 1998 | Dave F
0.050" -> 50 mil -> 50 pitch | 0.80 mm -> 0.032" -> 32 mil -> 32 pitch | 0.64 mm -> 0.025" -> 25 mil -> 25 pitch | 0.50 mm -> 0.020" -> 20 mil -> 20 pitch | 0.40 mm -> 0.016" -> 16 mil -> 16 pitch | 0.20 mm -> 0.012" -> 12 mil -> 12 pitch | Dave F Y
Electronics Forum | Thu Mar 19 11:04:28 EDT 2015 | eliran
Hi, I need to replace a LGA component from assembled boards. What are the best methods (automated ones preferred) for this process? The main issue is how to apply solder paste for the fine pitch (0.4mm) on assembled board. Thanks, Eliran Ave
Electronics Forum | Fri Sep 23 03:52:41 EDT 2005 | dougs
Hi, Does anyone know if it's possible to place BGA's with pitch 0.5mm and ball diameter 0.25mm on a siemens F3. the manual says that smallest pitch on BGA's is 0.56mm. Siemens won't commit a yes or no, as you'd expect, but i'd have thought it w
Electronics Forum | Fri Mar 23 23:26:40 EDT 2007 | mika
Hi, We are facing a complete new package type for us in our prototype production. RoHS LGA 36 Land Grid Array with 36 so called pads instead of bumps underneath. It is totatlly flat. This component is only 6.5 x 3.5 x 1.6 mm and we recieved them in a
Electronics Forum | Fri Apr 06 12:25:55 EDT 2007 | mika
Thanks DaveF, Ohh I still whish there was a way to share some pictures... * Pads on pcb are very very strange: It varies from a non uniform pattern but after we measure these I would say ~0.22 - 0.24mm dia. Haha, We have never discovered such a stra
Electronics Forum | Wed Jun 10 17:30:44 EDT 1998 | FAC
When creating part data�s for BGA or QFP style components, the line scan camera will be utilized (Camera No. 4). Using a Single nozzle type placing head, a nozzle capable of sufficient vacuum, and front lighting the part can achieve placement of a 74
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