Electronics Forum | Sat Jun 05 07:37:25 EDT 1999 | Dave F
| We are changing from through-hole to SMT, wondering what pitch requirements would an 8 pin SOAC require for pick and place? We think that this would be our finest pitch part. | John: Never heard of an "SOAC." SO packages are 50 ptch (50 mil, 1
Electronics Forum | Mon Jun 07 09:28:56 EDT 1999 | John Martell
Thanks a lot,, so assuming we are using standard parts, with nothing out of the ordinary we could safely assume that a machine capable of 20 mil would be more than able to meet our needs down the road. | We are changing from through-hole to SMT, won
Electronics Forum | Mon Jun 07 13:51:48 EDT 1999 | Dave F
| | We are changing from through-hole to SMT, wondering what pitch requirements would an 8 pin SOAC require for pick and place? We think that this would be our finest pitch part. | | | | | | | John: Never heard of an "SOAC." SO packages are 50
Electronics Forum | Mon Jun 07 20:12:42 EDT 1999 | John Martell
Thanks for the advice, I'll check out that site. | | | We are changing from through-hole to SMT, wondering what pitch requirements would an 8 pin SOAC require for pick and place? We think that this would be our finest pitch part. | | | | | | | |
Electronics Forum | Fri Mar 02 00:21:38 EST 2007 | AMS
Hello, I havea 0.4mm pitch TQFP with heat transfer pad on the bottom side of component. I will appreciate any suggestions with regards to: 1) stencil thickness (Rest of components on board are 0603 passives and few 40 mil pitch IC's) 2) Stencil
Electronics Forum | Wed Mar 02 06:19:03 EST 2005 | pjc
Go to http://www.ipc.org and look up IPC-7351 - Generic Requirements for Surface Mount Land Pattern and Design Standard The successor to the IPC-SM-782A is here! The document covers land pattern design for all types of passive and active components
Electronics Forum | Mon Feb 28 06:06:04 EST 2005 | Guest
I'm looking for recommendations on pad and stencil design for products with 0.5 mm pitch BGA's. The latest info that I found in the archives of this forum dated more than a year ago. It didn't give me much confidence that assembly of such components
Electronics Forum | Mon Oct 21 23:48:13 EDT 2002 | harris
Hi: If anyone have the experience with the PCB pad design and stencil design for the uBGA? We meet the problem for it. The component data is 0.3mm diameter and 0.5 pitch. Could anyone tell me the PCB pad dimension, the stencil type and aperture dimes
Electronics Forum | Wed Jul 17 10:59:26 EDT 2002 | fraser
Piece of cake, our sencil design software not only automaticaly mods the data for all component pitches but can apply anti solder ball designs ( homebase, form4 vnotch etc). As an added bonus it warns when the side wall to surface area ratio exceeds
Electronics Forum | Mon Jun 28 08:25:54 EDT 2004 | Scott Dodge
What is the difference between a smooth finish organic coated bare copper board for fine-pitch components and HASL finish?
