Electronics Forum | Tue Feb 22 12:02:11 EST 2005 | siverts
The first thing to do, as always with any trouble shooting, is to try to isolate your problem area, then it is much easier to pinpoint and find a solution for the problem. Some simple checks you can do, besides the good suggestions you got from some
Electronics Forum | Fri Jun 14 14:25:05 EDT 2002 | davef
Good job clarifying things. So, your MELF are just rolling off the pads. So much for the rocket scientist that talked you into those �V� shaped apertures, eh? [Or taking it the other way: Wow, just think how bad it would be if they weren�t worki
Electronics Forum | Thu Dec 12 21:38:02 EST 2019 | peterhuang
Does anyone encounter components sticky problems? I think it should be ESD problem in cover tape.
Electronics Forum | Sun Dec 22 21:56:17 EST 2019 | sssamw
yes, contamination could cause sticky also.
Electronics Forum | Sun Dec 22 22:10:07 EST 2019 | peterhuang
Whatever, we process the cover tape to troubleshoot the provlem.
Electronics Forum | Mon May 18 02:23:57 EDT 2020 | peterhuang
We can use cover tape to solve, SMT throwing rate can be reduced to less than 3%.
Electronics Forum | Fri Dec 20 10:00:37 EST 2019 | sangbui
Hello, We have the same problem as you. We have used Acetone to remove sticky successful. Thank you
Electronics Forum | Thu Aug 05 19:10:53 EDT 2004 | celldude
wash->ssd top->wash->sticky flux bottom side->place smt components->reflow->wash->sticky flux top side->place topside smt components->reflow->wash) ssd is basically the process of applying solder paste to the pcb with a stencil and the solder reflowe
Electronics Forum | Tue Nov 19 02:15:35 EST 2024 | auriga2001
Since you are using Siplace X series equipment, have you checked the Siplace ProDesk software for the component shape settings for that part? There is a section in 'handling' that has 'placement air kiss' settings. That gives a little burst of air to
Electronics Forum | Wed Aug 03 07:29:03 EDT 2022 | pradeep14
Hi, We are facing the issue with Component orientation(Wrong orientation), during Proto build/NPI time in SMT for 1st board placement. We are not doing 1st board with STICKY board, directly placing the components with Paste board only. Pls suggest, H
