Electronics Forum | Fri Nov 03 07:28:27 EST 2006 | davef
Via filling methods are: * Tenting * Plugging * Capping * Flooding Tented Via. A via covered with dry film soldermask; the via is not filled. When tenting from both sides there may be issues with trapped air that expands during mass soldering. Plug
Electronics Forum | Mon Mar 26 07:38:26 EDT 2007 | davef
The temperature that will melt solder holding top side SMT components during wave soldering depends on the alloy of that solder. So, for example, you'd expect: * Near eutectic SnPb solder to melt around 215*C. * LF to melt around 240*C. It's common
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