Electronics Forum | Mon Nov 11 11:28:32 EST 2002 | davef
Sand is not a great conductor, compared to copper. Never heard of using the stuff on RF boards. Our board fabricator uses Dupont CP100, now CP101, [or something like that cuse who's going to check?] when plugging via on cheap boards. Your board fa
Electronics Forum | Mon May 14 16:36:58 EDT 2012 | davef
You're thinking correctly in trying to improve your process. Can you change to a more active flux? Look at the copper that connects to the center pin. You may need to relay-out the board to add a wagon wheel style thermal relief in that area.
Electronics Forum | Mon May 14 12:44:08 EDT 2012 | tomgervascio
I am a user of an Ersa Versaflow 3/45. I was wondering if anyone could share some process pointers. I have a 0.125" multilayer PCB that I am having problems consistently achieving 75 percent hole fill on a mini-coax connector. The coax connector ha
Electronics Forum | Mon Feb 06 13:00:51 EST 2006 | amol_kane
Hi all, I just wave soldered 40 boards (20 if Imm Sn and 20 of Imm Ag) using SAC 305 (in this case the wave machine manufacturer (electrovert) suggested the alloy too). plan to carry out x-sectioning to see the results. overall, just from the visual
Electronics Forum | Sun Feb 05 09:29:12 EST 2006 | Cmiller
Look at: http://thor.inemi.org/webdownload/newsroom/Presentations/09.pdf Page 47 shows both alloys to be similar in reliability although its a little troublesome that the particular defects are not isolated as I feel there is a big difference betwee
Electronics Forum | Sun Oct 20 19:42:29 EDT 2002 | sjpence
Like Russ, I am also curious about the 100% fill requirement. On any thick, high mass board the key is getting as much heat as possible into the board. If you get the board to the proper temperature, solder will flow just about anywhere. As an alte
Electronics Forum | Wed Sep 01 14:31:22 EDT 1999 | Dave F
| To aid in heat dissipation of our PCB, we would like to try having copper fill areas on the board that are hot air levelled and not covered with solder resist. Then, when the board is reflowed, solder paste would be applied and then solder. Has any
Electronics Forum | Thu Sep 02 04:26:02 EDT 1999 | Wolfgang Busko
| | To aid in heat dissipation of our PCB, we would like to try having copper fill areas on the board that are hot air levelled and not covered with solder resist. Then, when the board is reflowed, solder paste would be applied and then solder. Has a
Electronics Forum | Wed Sep 01 12:26:32 EDT 1999 | Jae Hinson
To aid in heat dissipation of our PCB, we would like to try having copper fill areas on the board that are hot air levelled and not covered with solder resist. Then, when the board is reflowed, solder paste would be applied and then solder. Has anyon
Electronics Forum | Thu Apr 02 11:27:49 EST 1998 | Mike c
I am looking for a product to repair PCB mask (seal exposed copper) and fill Gouges in pcbs, any suggestions?
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