Electronics Forum | Wed Sep 27 08:28:05 EDT 2006 | AR
Hi all All you wave soldering people, have you had any trouble in keeping the copper level of your SAC solder pots under control? How do you combat the gradual rise of copper contents owing to dissolution from through-hole component leads etc.?
Electronics Forum | Wed Aug 09 16:30:43 EDT 2000 | MarkS
Has anyone had (successful) experience placing testpoint vias under BGAs? We already have conventional vias, but we're contemplating converting them into testpoints (probably by enlarging the bottom-side copper diameter to .036" and opening the bott
Electronics Forum | Tue Jul 07 08:42:49 EDT 2009 | ewchong
kpm, you are probably right. under magnification those two pads show some exposed copper which means that they were contaminated or had insufficient solder paste before reflow.
Electronics Forum | Fri May 17 15:50:17 EDT 2002 | davef
Now that�s a switch. Most are moving or properly have moved in the polar opposite direction. Dano, has someone been drilling your teeth lately? We use water washable flux to: * Remove solder balls. [Or put another way, we don�t have to screw-down
Electronics Forum | Thu Jan 10 11:22:48 EST 2013 | pbarton
Looks to me like under etching of the underlying copper and the gold is just plated to all of the exposed copper surface. Is this characteristic the same on all solderable pads? You will not be able to remove this gold.
Electronics Forum | Sun Aug 15 05:45:15 EDT 1999 | Brian
Boca, Dave Sorry, but I cannot let this go. I'll go along with you that, at the time that the Montreal Protocol was initially signed (September 1987), there was no scientific proof that CFCs etc. were causing ozone depletion. There was, however, ve
Electronics Forum | Wed Jun 30 11:38:05 EDT 1999 | Brian Conner
| We are wave soldering some fabs with a lot of unmasked trace area along the edges. The trace area is solid copper covered with tin / lead, no masking, no components along the edges, same on solder side and component side (goofy board design). Ins
Electronics Forum | Tue Dec 23 11:55:37 EST 2003 | Marc Simmel
Details, details: 1) The metal shell is part of the component body. The base metal is austenitic stainless steel (304) that has been plated with 90/10 tin-lead over nickel (semi-bright). 2) The entire part (leads and shell) is elevated by the mass o
Electronics Forum | Wed Jun 30 12:14:40 EDT 1999 | John Thorup
| | We are wave soldering some fabs with a lot of unmasked trace area along the edges. The trace area is solid copper covered with tin / lead, no masking, no components along the edges, same on solder side and component side (goofy board design). I
Electronics Forum | Fri Jul 02 10:06:17 EDT 1999 | John Thorup
| | | | We are wave soldering some fabs with a lot of unmasked trace area along the edges. The trace area is solid copper covered with tin / lead, no masking, no components along the edges, same on solder side and component side (goofy board design)
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