Electronics Forum | Wed Apr 21 00:35:31 EDT 1999 | Scott Cook
| Netters, | | When I reflow a PCB there is a discoloration of silkscreen and mask. It appears if Profile is too hot! But I dont think so, maybe I'm wrong? | | 1. Kester 293 no clean | 2. 2.1 C/s for 30s to 150 C | 3. .5 - .7 C/s for 60s to 185
Electronics Forum | Tue Oct 01 10:47:45 EDT 2002 | davef
Board fabricators purchase laminate in preferred panel sizes, such as: 16 x 18 inches, 18 x 24 inches, and 21 x 24 inches. A larger panel size provides more effective cost per unit area processed. In producing a board, the fabricator requires maybe 3
Electronics Forum | Tue Nov 07 21:49:05 EST 2000 | Dave F
Cheers to you Your gold plating is specified for the gold wire bonding between the die of your BGA and the pads on the BGA substrate. For solderable surfaces this is heavy on gold for use on pads. Gold SB thinner on pads to limit the amount of gol
Electronics Forum | Tue Jun 08 12:49:41 EDT 1999 | Dave F
| Hi,my master | How to iron out such soldering bridge with below conditions: | 1.The component(Harness)lead pitch is 2.0mm,the lead length is 3.2mm. | 2.PCB width is 1.6mm.Pad size is 1.65mm.Its a single copper PCB | 3.using spraying fluxer and n
Electronics Forum | Tue Jun 08 13:06:53 EDT 1999 | Kevin Hussey
| | Hi,my master | | How to iron out such soldering bridge with below conditions: | | 1.The component(Harness)lead pitch is 2.0mm,the lead length is 3.2mm. | | 2.PCB width is 1.6mm.Pad size is 1.65mm.Its a single copper PCB | | 3.using spraying fl
Electronics Forum | Tue Jun 08 14:16:49 EDT 1999 | Dave F
| | Hi,my master | | How to iron out such soldering bridge with below conditions: | | 1.The component(Harness)lead pitch is 2.0mm,the lead length is 3.2mm. | | 2.PCB width is 1.6mm.Pad size is 1.65mm.Its a single copper PCB | | 3.using spraying fl
Electronics Forum | Wed Jul 14 09:56:54 EDT 1999 | Wolfgang Busko
| | I am examining cut & form PTH component prep equipment to help in our manual PTH insertion process. We need the ability to process both axial & radial with snap-in and stand-off capability. Low volume with the ability to feed bulk, T&R, or Stick.
Electronics Forum | Thu Mar 11 10:31:57 EST 1999 | Justin Medernach
| NASA CommQuest | | | Photopolymerized Conducting Polymers | | Directions: | 1.Please read the information provided on this technology. You may follow the links to additional information resources below. | | 2.After evaluating the technology,
Electronics Forum | Fri Sep 17 09:54:40 EDT 1999 | Brian
| | | We have some SMT components with gold plated leads. They're actually LCC led packages. A good solder alloy to use would be Indium / Lead to reduce tin dissolution into the gold and avoid the resultant brittle intermetallic compound. However, a
Electronics Forum | Fri Sep 17 10:09:17 EDT 1999 | Earl Moon
| | | | We have some SMT components with gold plated leads. They're actually LCC led packages. A good solder alloy to use would be Indium / Lead to reduce tin dissolution into the gold and avoid the resultant brittle intermetallic compound. However,
