Electronics Forum | Fri May 14 09:00:55 EDT 2004 | neil
Yes, the SMTneters corner is still available. We just didn't keep the navigation link to it. You can find it here: http://www.smtnet.com/smtneters/ Neil
Electronics Forum | Thu May 13 13:18:51 EDT 2004 | cyber_wolf
Is this feature still available on this website ? Is there still some way to look at an individuals postings ?
Electronics Forum | Tue Nov 15 15:37:05 EST 2011 | comatose
I have a new (to me) Vitronics XPM3 oven which we're hooking up. It requires 480V, and I only have real 208V in the facility. I have a transformered up 480 subsystem, but its corner grounded rather than center grounded. The XPM3 manual suggests tha
Electronics Forum | Wed Jan 16 22:57:52 EST 2008 | amarpreet41
Any one got experience on handling solder bridging under one corner of BGA?
Electronics Forum | Wed Jun 25 11:06:35 EDT 2003 | James
Does anyone else have the same problem with BGAs that have a gold corner. It looks like the area where the gold corner is, it does not want to reflow proberly but the rest of the BGA reflows fine. Any suggestions????
Electronics Forum | Wed Dec 06 21:59:37 EST 2006 | SMTrework
Hello, we rework BGA packages that come back from the field. I've seen on occasion a black and or red "epoxy" substance from the manufacturer on the corner of some board's BGA chips that I imagine are applied to increase corner bond of the chip to th
Electronics Forum | Wed Dec 06 22:35:05 EST 2006 | davef
Questions are: * When you say, "corner of some board's BGA chips", is it on the top of the package or between the board and the bottom of the package? * If between the board and the bottom of the package, does it span the distance between the board a
Electronics Forum | Wed Jun 25 12:08:53 EDT 2003 | russ
I battle this all the time, I don't believe that it is the "gold corner" that is causing the problem but something with the PCB layer makeup (copper planes, or bottom side components, etc.). It could also be the nozzle you are using has a "hot spot/
Electronics Forum | Wed Dec 06 22:46:39 EST 2006 | SMTrework
Hi Dave, This is manufacturer applied epoxy / adhesive to minimize package "lifing" from chassis flexing and thius board flexing. I have seen the complete array area covered with this black or red epoxy in some cases (i.e. the underfill that I've
Electronics Forum | Thu Dec 07 03:21:54 EST 2006 | Guest
Materials you see are corner bond adhesive, main purpose of this is mechanical shock absorber , it promotes additional adhession to lessen stress to solder joints incase device subjected to mechanical stress like dropping.By function, corner bond
