Electronics Forum | Wed Sep 03 16:59:13 EDT 2008 | glennster
At a former employer we required HASL thicknes to be a minimum of 0.75 micron (30 microinches), as measured at the thinnest point on any given pad. This would generally assure a minimum 1 year solderability shelf life. Usually when we saw a soldera
Electronics Forum | Tue Feb 01 12:00:01 EST 2000 | K. Ckak
Hi Folks, I am looking for some info. and possibly a source on measuring inprocess copper plating thickness for Flex PCB manufacturing facilities. I have tried XRF, E-Current method but the supplier told us that it wont work with Flex material - th
Electronics Forum | Wed Feb 02 20:43:56 EST 2000 | Dave F
KC: Try: 1 http://www.rogers-corp.com/cmu/techindx.htm Circuit Materials Division Tech Tips Index: Techtip #9: Measurement of Copper Thickness by the Weight Method 2 Andy Magee - Flex Guru Senior Consultant, Bourton Groupmagee@donet.com (937) 435-
Electronics Forum | Thu Jan 04 08:33:08 EST 2007 | davef
You cannot determine foil thickness from its weight per area, because of the significant variation in the density of electrodeposited [ED] copper. But people don't care. They do it regardless. (oz/ft2)||(mils)||(mm) 1/2||0.7||17.8 1||1.4||35.6 2||2
Electronics Forum | Mon Oct 25 11:15:10 EDT 2004 | davef
We assume by "stencil tension" you mean a measurement of how securely [or how tauntly] the stencil foil is held in the stencil frame. If so, we do not know how you would go about making your "30 ~ 50 N/cm" limit measurement when verifying conformanc
Electronics Forum | Thu Jul 19 09:56:52 EDT 2001 | Damian Holzmann
The obvious difference between 2D and 3D is that an accurate volumetric measurement can only be obtained with a 3D measuring system. Laser line measurement in 2D does not allow accurate volumetric measurement. If you modify the aperture in a stencil
Electronics Forum | Fri Sep 03 04:00:10 EDT 2010 | sachu_70
James, Are you referring to oxidation caused on outer layers of PCB on account of poor OSP finish over Cu?
Electronics Forum | Tue Nov 07 10:25:19 EST 2000 | Thomas Ballhausen
Thank you for your kind contribution and efforts in helping me. I just found out we have been talking different units; my microns were micro meter ...? So, let me get things right now: the substrate supplier confirmed the following data: Cu foil +
Electronics Forum | Wed Jul 06 20:33:39 EDT 2005 | davef
Pat In response to your questions: Q1. How did you measure the area reduction (loss of weight or reduction of diameter/thickness)? A1. We measured the starting and ending diameter. Then calculated the area [assuming symmetry]. Q2. How did you tak
Electronics Forum | Wed Oct 10 16:16:15 EDT 2001 | lisa
Hello all, I'm looking for some advice on inter-metallic formation. I have some circuit board finished with Immersion Tin, Immersion Silver and OSP. They have been reflowed with solder past and components,the joints look good. What can I expect fo
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