Electronics Forum: defect (Page 168 of 227)

X7R woes

Electronics Forum | Wed Jan 04 13:47:11 EST 2006 | russ

To answer your question it was mentioned that allowing the boards to cool slightly between reflow and wash may help this case to eliminate thermal shock from immediately going into colder water straight out of the oven with no cooling. In looking at

AOI vs. electrical test

Electronics Forum | Wed Jan 04 12:48:34 EST 2006 | pjc

In-Circuit Test is the best method for ensuring solder joint connections. It is a much more reliable than AOI. An ICT machine can ensure solder connections are made for array package devices such as BGA, PGA, etc... AOI is best for component I.D.- is

AOI vs. electrical test

Electronics Forum | Wed Jan 04 14:59:41 EST 2006 | AOI

I have used all of test and inspection techniques available out there: AOI, AXI, Flying Probe, ICT, and FCT. The reality is that they all have a place in manufacturing based on the type and complexity of product you bild, the industry it is intended

Solder Paste Evaluation

Electronics Forum | Thu Feb 02 09:06:53 EST 2006 | drewake

Sorry, I am jumping into this late - I'm a new user. Our company is looking to perform an evaluation for a new paste. We are looking at a 63/37 no clean - type 3 or 4. Our technology is currently at 0201s, .4mm pitch ICs & .5mm uBGAs. I have

Do you need to bake after parts are in the Dry Cabinet

Electronics Forum | Thu Jan 26 17:59:07 EST 2006 | GS

How is RH% inside your Dry Cabinet ? What is the most critical MDL of your MSDs soldered on your board ? Best instructions about Handling of MSD you can get from Standard J-STD-033B/C. The defects you encountered at test it could be moisture absor

Lead free tin copper only

Electronics Forum | Sun Feb 05 09:29:12 EST 2006 | Cmiller

Look at: http://thor.inemi.org/webdownload/newsroom/Presentations/09.pdf Page 47 shows both alloys to be similar in reliability although its a little troublesome that the particular defects are not isolated as I feel there is a big difference betwee

SPC for Wave solder (defects on PCB's)

Electronics Forum | Wed Feb 15 08:47:09 EST 2006 | pjc

Yes, doing the DoEs on your wave to achieve optimum settings that deliver the best results on your worst board is correct method. If not clear on the process, there are still wave solder process classes out there you can attend or hire in-house. If y

SPC for Wave solder (defects on PCB's)

Electronics Forum | Wed Feb 15 13:44:34 EST 2006 | samir

Bingo! In my career, I've used Wave Solder optimizer and the WaveRIDER. Pro's and Con's to both. I did a GR&R on both as well, and WaveRIDER came out on top. The main challenge is to get the operators to use it. I've found that the operators wer

Internal Oven Calibration

Electronics Forum | Wed Feb 22 12:06:23 EST 2006 | Chunks

I agree with Steve and would hate to have Ken audit me. "Mrs. Chunks, sure your profile looks like the manufacturers recommended spec, your oven is calibrated to the best you can do or afford, your profiler is also calibrated to the best of your cap

SMT line validation

Electronics Forum | Wed Feb 22 20:11:59 EST 2006 | slthomas

*Qualify* your equipment by running X boards, Y times, through each piece of equipment under normal operating conditions and quantifying the performance, as in a ppm rating. Then validate your process by defining all of the steps you use to generate


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